...A. Polyakov; M. Bartek; J. N. Burghartz This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile methods. The measured fracture toughness is 53.5 ± 3.9 J / m 2...

... induced stresses, or process-induced intrinsic stresses or a combination of these different loads. In order to design against delamination, knowledge of the interfacial fracture toughness of the Ti/Si interface is necessary. However, interfacial fracture toughness data for such interfaces is not widely...

.... 01 March 2003 30 04 2004 silicon elemental semiconductors surface roughness surface morphology fracture toughness polishing sputter etching grinding 7 Fracture strength vs. fine-grinding depth 4 Roughness (Ra) vs. wafer thinning conditions Figure...

... by the EPPD Division, December 27, 2001, Associate Editor: K. Kishimoto. 27 December 2001 14 03 2003 flip-chip devices Weibull distribution fracture toughness integrated circuit reliability integrated circuit packaging Monte Carlo methods silicon Strength Reliability Silicon...

... 01 May 2002 12 12 2002 plastic packaging integrated circuit packaging fracture mechanics integrated circuit reliability failure analysis delamination thermal stress cracking finite element analysis fracture toughness It is common knowledge in mechanical engineering...

...Shoji Kamiya; Hironori Takahashi; Masumi Saka; Hiroyuki Abe´ CVD diamond particles were produced on silicon substrates under various conditions such as different methane concentration in the source gas mixture and the substrate temperature. Adhesive fracture toughness of these diamond particles...

... with respect to the acceleration of the onset of package delamination. In this paper the effect of moisture on the interfacial fracture toughness of two no-flow underfill materials with a commercially available solder mask coated FR-4 board is experimentally determined. Bilayer specimens with prefabricated...

... ). Therefore, the objective here is to identify the conditions for crack deflection. 3 Interfacial and cohesive failure Let the fracture toughness of the interface be G ic and that of the polymer be G pc . Then, based on the linear elastic fracture mechanics...