... bonding. ( c ) Five-wire bonding. ( d ) Lead frame. Results of maximum temperature of the Si chip; LF: lead frame. 29 11 2009 08 08 2010 30 09 2010 30 09 2010 cracks fracture mechanics insulated gate bipolar transistors lead bonding power bipolar transistors...

... [ Towashiraporn, et al., 2005, “A Hybrid Model for Computationally Efficient Fatigue Fracture Simulations at Microelectronic Assembly Interfaces,” Int. J. Solids Struct., 42(15), pp. 4468–4483 ]. We review well understood principles in elastic-plastic fracture mechanics and more recent work in cohesive zone...

... was achieved and the fracture interfaces were examined and analyzed depending on the induction heating time and packaging pressure. 13 04 2009 16 09 2009 12 11 2009 12 11 2009 ceramic packaging fracture mechanics induction heating temperature distribution tensile strength...

.... A dreaded failure cause is delamination. Therefore it is interesting to have a modeling tool, which can provide information on possible delamination risks. In this paper, a short overview of existing appropriate analyzing techniques is presented, focusing on the fracture-mechanics approach...

... behavior relative to Sn–Pb alloys. In this paper, a hybrid fatigue modeling approach inspired by nonlinear fracture mechanics is developed to predict the crack trajectory and fatigue life of a solder interconnection. The model is shown to be similar to well accepted cohesive zone models in its theoretical...

... by the approaches of stress analysis and fracture mechanics. The model for analysis is the plastic Small Outline J-lead package with a dimpled diepad. On the package without a crack, the stress analysis is done and the possibility of delamination is considered. For the model fully delaminated between the chip...

.... As the dominant fracture mechanism of silicon dies is brittle fracture, the die strength will depend critically on the largest flaw size induced in manufacturing processes such as grinding. It is therefore crucial that a test configuration is able to generate a uniform stress field on a large area in the test...

...Bulu Xu; Xia Cai; Weidong Huang; Zhaonian Cheng Fracture mechanics approaches have been used to study reliability problems in electronic packages, in particular, adhesion related failure in flip chip assembly. It was verified in this work that the J-integral with a special flat rectangular contour...

.... S. , 1976 , “ On the Use of Isoparametric Finite Elements in Linear Fracture Mechanics ,” Int. J. Numer. Methods Eng. , Vol. 10 , pp. 25 – 37 . Blandford , G. E. , Ingraffea , A. R. , and Liggett , J. A. , 1981 , “ Two Dimensional Stress Intensity Factor Computations using...

... identified. Based on the experimental results, the processes of delamination growth and subsequent resin cracking are clarified. The effect of the length of the delaminations on the resin cracking is numerically analyzed on the basis of the linear fracture mechanics approach combined with finite element...

...Michael C. Larson, Mem. ASME; Melody A. Verges, Mem. ASME A fracture mechanics approach is used to investigate how the fatigue life of a solder grid array (SGA) may be increased or decreased by the application of an axial force to individual solder interconnects, such as may be induced by use...

...Bernd Michel,, Guest Editor, Poly’2000 Co-chair; Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair 12 12 2002 reliability polymers adhesion adhesives plastic packaging integrated circuit packaging fracture mechanics stress effects thermal management (packaging...

... 01 May 2002 12 12 2002 plastic packaging integrated circuit packaging fracture mechanics integrated circuit reliability failure analysis delamination thermal stress cracking finite element analysis fracture toughness It is common knowledge in mechanical engineering...

... at different thermal cycles are measured. Also, the average strain energy density around the crack tip of different crack lengths in the corner solder joint is determined by a time-dependent nonlinear fracture mechanics with finite element method. The solder is assumed to be a temperature-dependent elastic...

... the interfacial adhesion. Roughened surfaces generally produce more cohesive failure; therefore, they are used commonly in practice to obtain better adhesion. This paper develops a fracture mechanics model that can be used to quantitatively predict the amount of cohesive failure once the surface roughness data...

... Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associate Technical Editor: B. Michel. thin films multilayers internal stresses fracture mechanics stress-strain relations crack-edge stress field analysis Many engineering devices are constructed by bonding...

... manuscript received August 2000. Associate Editor: G. De Mey. 01 December 1999 01 August 2000 flip-chip devices delamination integrated circuit reliability finite element analysis thermal stress cracking integrated circuit packaging fracture mechanics Flip-chip and solder...

... at the corner solder joint with different crack (delamination) lengths. Also, the strain energy release rate and phase angle at the crack tip of the interface between the underfill and solder mask are obtained by fracture mechanics. [S1043-7398(00)01104-X] Contributed by the Electrical and Electronic...

... undamaged material is modeled as an array of dislocations. The three scales are then combined together to incorporate damage mechanisms into continuum analysis. Traditional fracture mechanics provides a crack propagation model based on pre-existing cracks. The present work provides an approach...

...J.-B. Han Fracture mechanics is applied to flip-chip BGA design to avert die cracking from its backside. Fracture mechanics is integrated with the finite element analysis (FEA) and design of virtual experiments (virtual DOE) to analyze the effects of location and length of a die crack...