... With Rare Earth Element Additions ,” Mater. Sci. Eng. R. , 44 ( 1 ), pp. 1 – 44 . 0927-796X 20 11 2007 13 11 2008 01 04 2009 copper compounds electronics packaging fine-pitch technology laser beam applications nickel compounds silver compounds soldering tin compounds...

... devices nanoparticles soldering assembling fine-pitch technology fatigue testing mechanical testing delamination fatigue cracks fracture passivation silicon compounds To enhance solder bump reliability in flip chips on organic substrates, an epoxy-based underfill is often dispensed...

... Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received September 2003; final revision, February 2004. Associate Editor: Guo-Quon Lu. 01 September 2003 01 February 2004 06 10 2004 solders flip-chip devices ageing indentation fine-pitch technology...

... production planning manufacturing processes assembling soldering surface mount technology fine-pitch technology printed circuit manufacture integrated circuit reliability laser beam applications 01 March 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division...

... fine-pitch technology Fine pitch devices are widely used in the advanced electronic surface mount technology (SMT) with the increased demand for high integration, high packaging density and high speed performance. The lead pitch of QFP device passes 0.04 centimeters. A serious defect...

... 2003 fine-pitch technology soldering flip-chip devices integrated circuit interconnections integrated circuit packaging aluminium microassembling Since the inception of C4 (controlled collapse chip connection) technology by IBM for their solid logic technology (SLT) more than...

... received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 adhesives packaging fine-pitch technology electrical conductivity conducting polymers nickel gold contact resistance The simple connection method using anisotropic conductive adhesive (ACA) is noted...

... of the intrinsic stress is re-induced back in the spring, and it varies linearly with compression for most of the compression range. The stress reaches a constant value after a certain compression range. micromechanical devices probes integrated circuit testing production testing fine-pitch technology...

... with ultra-fine pitch technology. flip-chip devices adhesives fine-pitch technology conducting polymers circuit reliability environmental testing contact resistance electric resistance measurement filled polymers 27 July 1999 26 07 2002 Contributed by the Electronic...

... May 10, 2001. Associate Editor: B. Courtois. integrated circuit packaging flip-chip devices conducting materials adhesives finite element analysis electrical contacts fine-pitch technology Liquid crystal displays (LCD) have increasingly found industrial applications owing...

... of MAP-BGA have been studied. Two conclusions are summarized below. 08 August 2000 ball grid arrays reliability moulding fine-pitch technology Plastic Ball Grid Array (BGA) and other area array packages have a large impact on the IC market all over the world due to its ease...