... 2006 04 04 2007 ceramics conducting polymers crushing dielectric losses electronics packaging encapsulation filled polymers particle size permittivity sieving silicon compounds thermal conductivity thermal conductivity polymer composite ceramic filler dielectric...

... PACKAGING . Manuscript received Sept. 2001; final revision, March 2002. Associate Editor: A. Y.-H. Hung. 01 Sep 2001 01 March 2002 17 09 2003 thermal conductivity contact resistance filled polymers shear modulus percolation Particle-laden polymeric thermal interface...

... impact testing impact strength filled polymers conducting polymers shear strength bending strength scanning electron microscopy Surface mount technology (SMT) continues to be significantly important to the electronics manufacturing industry. Currently, SMT mainly uses lead-tin as soldering...

... Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 fracture toughness testing notch strength encapsulation plastic packaging integrated circuit packaging finite element analysis filled polymers reflow soldering delamination particle reinforced composites...

... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD May 3, 2001. Associate Editor: Z. Suo. 03 May 2001 26 07 2002 filled polymers particle reinforced composites thermal resistance packaging cooling Polymer...

... with ultra-fine pitch technology. flip-chip devices adhesives fine-pitch technology conducting polymers circuit reliability environmental testing contact resistance electric resistance measurement filled polymers 27 July 1999 26 07 2002 Contributed by the Electronic...

.... Uniform and virtually defect-free filled-polymer dielectric films were obtained with Shipley XP9500CC at 50 vol. percent filler loading. Dielectric film thickness varied within + / − 5   percent in a 10 micron thick film. Photo- versus non-photodefinable nanocomposites capacitor...

.... 11 January 2000 silicon compounds filled polymers moulding thermal stresses integrated circuit packaging plastic packaging integrated circuit reliability thermal expansion compressive strength elastic moduli thermoelasticity The residual thermal stresses in molding...

... circuit reliability filled polymers diffusion moisture moulding sorption plasticity Young's modulus tensile strength bending strength Moisture sorption in molding compounds employed in plastic packaging of integrated circuit (IC) devices has been treated by the majority of investigators...