...-u.ac.jp 09 09 2021 21 12 2021 28 01 2022 conductive inks reliability flexible circuit direct write failure analysis Japan Society for the Promotion of Science 10.13039/501100001691 19K04084 In recent years, printed electronics (PEs) have attracted...

..., a failure analysis of Ag nanoparticle ink lines were assessed using current loading tests and microscopic observations to discuss the damage mechanism and evaluate electrical reliability under high-density current. Atomic transport due to EM was observed at 60 kA/cm 2 current loading, and relatively large...

... gives more consistent failure times. Failure analysis for the tested devices shows the primary failure mode is “input” trace crack first, followed by fatigue through the solder for complete failure. A finite element (FE) model, correlated with experimental modal analysis, is shown to accurately estimate...

... LECTRONIC P ACKAGING . Manuscript received January 15, 2018; final manuscript received May 9, 2018; published online June 26, 2018. Assoc. Editor: Toru Ikeda. 15 01 2018 09 05 2018 Failure analysis MEMS Microsystems Physics of failure Reliability Sensors...

.... Assoc. Editor: Jin Yang. 28 01 2018 12 05 2018 Area array COB Failure analysis Flip chip Reliability Solder Nowadays, the urgent requirement of fine-pitch interconnects in microelectronic packages, and the utilization of lead-free solders considering environmental...

... manuscript received April 27, 2018; published online May 21, 2018. Assoc. Editor: Toru Ikeda. 12 10 2017 27 04 2018 Failure analysis Harsh environment Reliability Solder The fatigue failure of solder joints in printed circuit boards is one of the limiting factors...

... manuscript received March 20, 2018; published online May 9, 2018. Assoc. Editor: Eric Wong. 24 10 2017 20 03 2018 Electronic Failure analysis Harsh environment Metallographic cross sections were made of Au–Sn solder joint belonging to lid 7. The locations of those cross sections...

.... Fig. 8 Representative failure surfaces in die-shear testing of Bi–XSb–10Cu alloys Failure analysis after die shear testing revealed two failure modes in the die-attach joints. Delamination between Ni and NiSb as seen on the substrate side is shown in Fig. 8 (left) and a mixed mode...

... the required test duration was determined by functional tests and destructive physical failure analysis (PFA). In the field of lifetime tests , power cycling is playing the key for evaluating the thermo-electromechanical reliability and robustness of power stages. State-of-the-art is the use of current...

.... Editor: Ercan Dede. 18 09 2017 29 11 2017 Electronic Failure analysis Thermal analysis The global conditions in a data center are determined by computer room air conditioning (CRAC) set point temperature, mass flow rate of cold air being supplied to the room, and overall...

... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...

... Conference on High Density Microsystem Design and Packaging and Component Failure Analysis ( HDP ), Shanghai, China, June 27–30, pp. 242 – 246 . 10.1109/HDP.2006.1707600 3D packaging Area array Chip stacking Failure analysis High density interconnects Microsystems In two-dimensional...

... manuscript received March 1, 2017; published online June 14, 2017. Assoc. Editor: Jeffrey C. Suhling. 26 09 2015 01 03 2017 Composite materials COTS Failure analysis FR-4 Harsh environment MEMS Microsystems Nanotechnolgy PWB Reliability SMT The ever increasing...

...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...

... Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 26, 2016; final manuscript received April 3, 2017; published online April 28, 2017. Assoc. Editor: S. Ravi Annapragada. 26 12 2016 03 04 2017 Failure analysis Flexible...

... 17% and 7%, respectively, and of Fig. 12 are around 34% and 23% respectively. The results show the significant availability of outside air usage (free air cooling) at the Dallas test site during the year. Electronic Failure analysis Harsh environment Physics of failure Reliability Thermal...

... . Manuscript received June 14, 2016; final manuscript received October 25, 2016; published online November 10, 2016. Assoc. Editor: Mehdi Asheghi. 14 06 2016 25 10 2016 Chip stacking Failure analysis Harsh environment Micro vias SOC Thermal analysis Gallium nitride (GaN) based...

... . Manuscript received May 26, 2015; final manuscript received June 13, 2016; published online June 28, 2016. Assoc. Editor: Shi-Wei Ricky Lee. 26 05 2015 13 06 2016 3D packaging Chip stacking Failure analysis The three-dimensional integrated circuit (3D IC) is an emerging...

... 21 05 2016 22 05 2016 3D packaging CSP Failure analysis High density interconnects SMT List of JEP Reviewers Alekhya Addagatla David Hutt Kaustubh Nagarkar Dereje Agonafer Toru Ikeda Luu T. Nguyen S. Ravi Annapragada Toshitaka Ishizaki Mark...

... Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 7, 2015; final manuscript received February 15, 2016; published online March 23, 2016. Assoc. Editor: Yi-Shao Lai. 07 10 2015 15 02 2016 Failure analysis Power packaging...