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Keywords: elemental semiconductors
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
... in the model. The multiple transistors on the silicon chip are modeled by superimposing the results from the finite element analysis. 14 09 2010 23 08 2011 23 12 2011 23 12 2011 elemental semiconductors finite element analysis microprocessor chips semiconductor device models...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
Published Online: December 21, 2011
... 2011 adhesive bonding copper electronics packaging elemental semiconductors gold plates (structures) shear strength silicon solders thermal stresses thin films tin bimaterial assembly interfacial shearing stress peeling stress shear compliance bond layer...
Journal Articles
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020907.
Published Online: June 23, 2011
... and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm 2 K/W and 5 mm 2 K/W, respectively. 01 12 2009 13 01 2011 23 06 2011 23 06 2011 carbon nanotubes elemental semiconductors interface structure mechanical stability MIS structures organic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
Published Online: June 22, 2011
... silicon chip alumina substrate adhesive bonding alumina ductility elemental semiconductors gold integrated circuit bonding scanning electron microscopy silicon thermal expansion 22 10 2010 26 02 2011 22 06 2011 22 06 2011 2011 American Society of Mechanical...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021005.
Published Online: June 23, 2010
.... 09 10 2009 26 03 2010 23 06 2010 23 06 2010 cooling electronics industry elemental semiconductors heat pipes microfabrication silicon thermal conductivity thermal resistance microheat pipes electronic cooling thermal conductivity thermal resistance performance...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031013.
Published Online: July 31, 2009
... ) as a function of the temperature at 0 Pa. The dashed and solid lines correspond to a second-order polynomial fitting of the experimental results. 22 09 2008 27 03 2009 31 07 2009 electronics packaging elemental semiconductors finite element analysis membranes moulding...
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 25–28.
Published Online: March 21, 2005
... that is positioned at the outermost V-groove in the array, cannot be ignored. Manuscript received January 7, 2004; revision received August 13, 2004. Review conducted by: Y. C. Chan. 07 January 2004 13 August 2004 21 03 2005 silicon elemental semiconductors semiconductor device...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 301–307.
Published Online: October 6, 2004
... . Manuscript received February 2003; final revision, February 2004. Associate Editor: A. Y-H. Hung. 01 February 2003 01 February 2004 06 10 2004 titanium metallic thin films fracture toughness internal stresses delamination surface cracks adhesion silicon elemental...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 177–185.
Published Online: July 8, 2004
... 01 November 2003 08 07 2004 silicon elemental semiconductors grinding finite element analysis integrated circuit manufacture Until recently, internal-diameter (ID) sawing had been the dominant slicing method for the past three decades 11 12 . Wire sawing, however, is now...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 110–114.
Published Online: April 30, 2004
.... 01 March 2003 30 04 2004 silicon elemental semiconductors surface roughness surface morphology fracture toughness polishing sputter etching grinding In recent years, the rapid market growth in portable and hand-held products challenges the electronic packaging industry...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 271–276.
Published Online: July 26, 2002
.... T. Read. 20 August 1999 23 July 2001 26 07 2002 diamond CVD coatings adhesion fracture toughness elemental semiconductors semiconductor thin films nanostructured materials Synthetic polycrystalline diamond films produced by chemical vapor deposition (CVD...