... , E. , Sinha , S. , and Goodson , K. E. , 2006 , “ Heat Generation and Transport in Nanometer-Scale Transistors ,” Proc. IEEE , 94 ( 8 ), pp. 1587 – 1601 . 10.1109/JPROC.2006.879794 14 09 2010 23 08 2011 23 12 2011 23 12 2011 elemental semiconductors...

... adhesive bonding copper electronics packaging elemental semiconductors gold plates (structures) shear strength silicon solders thermal stresses thin films tin bimaterial assembly interfacial shearing stress peeling stress shear compliance bond layer Thermomechanical stresses...

... and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm 2 K/W and 5 mm 2 K/W, respectively. 01 12 2009 13 01 2011 23 06 2011 23 06 2011 carbon nanotubes elemental semiconductors interface structure mechanical stability MIS structures organic...

... be coated with smooth Au layers. The 260 °C bonding temperature is compatible with typical reflow temperature of Sn3.5Ag solders used in electronic industries. 22 10 2010 26 02 2011 22 06 2011 22 06 2011 adhesive bonding alumina ductility elemental semiconductors gold...

... electronics industry elemental semiconductors heat pipes microfabrication silicon thermal conductivity thermal resistance microheat pipes electronic cooling thermal conductivity thermal resistance performance enhancement factor Microscale heat pipe (MHP) arrays have been suggested...

.... Microeng. 0960-1317 , 8 , pp. 168 – 171 . 10.1088/0960-1317/8/2/032 22 09 2008 27 03 2009 31 07 2009 electronics packaging elemental semiconductors finite element analysis membranes moulding photoresists piezoresistive devices pressure sensors silicon...

... that is positioned at the outermost V-groove in the array, cannot be ignored. Manuscript received January 7, 2004; revision received August 13, 2004. Review conducted by: Y. C. Chan. 07 January 2004 13 August 2004 21 03 2005 silicon elemental semiconductors semiconductor device...

... thin films fracture toughness internal stresses delamination surface cracks adhesion silicon elemental semiconductors semiconductor-metal boundaries fracture toughness testing Knowledge of the mode mix dependent interfacial fracture toughness (Γ) is necessary to predict if delamination...

.... Associate Editor: M. Saka. 01 February 2003 01 November 2003 08 07 2004 silicon elemental semiconductors grinding finite element analysis integrated circuit manufacture Semiconductor wafers, over 90% of which are silicon 1 , are used as the substrates to build...

.... 01 March 2003 30 04 2004 silicon elemental semiconductors surface roughness surface morphology fracture toughness polishing sputter etching grinding 7 Fracture strength vs. fine-grinding depth 4 Roughness (Ra) vs. wafer thinning conditions Figure...

.... T. Read. 20 August 1999 23 July 2001 26 07 2002 diamond CVD coatings adhesion fracture toughness elemental semiconductors semiconductor thin films nanostructured materials Synthetic polycrystalline diamond films produced by chemical vapor deposition (CVD...