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Journal Articles

Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Open Access
Ercan M. Dede, Feng Zhou, Yuqing Zhou, Danny J. Lohan, Mehdi Asheghi, Kenneth E. Goodson, Kris Erickson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021009.
Paper No: EP-24-1066
https://doi.org/10.1115/1.4067649
Published Online: February 20, 2025
...Ercan M. Dede; Feng Zhou; Yuqing Zhou; Danny J. Lohan; Mehdi Asheghi; Kenneth E. Goodson; Kris Erickson Heterogeneous integration of electronics is critical to the next wave of electronics applications ranging from extremely power dense energy conversion systems to advanced chiplet and copackaged...
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Topics: Additive manufacturing, Ceramics, Design, Electronics, Heat sinks, Manifolds, Manufacturing, Metals, Polymers, Cooling
Journal Articles

Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System

Available to Purchase
Cheng-Wei Tien, Kun-Huang Yu, Wen-Junn Sheu, Chi-Chuan Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024501.
https://doi.org/10.1115/1.3103940
Published Online: March 27, 2009
... , “ Experimental Investigation of a Miniature-Scale Refrigeration System for Electronics Cooling ,” IEEE Trans. Compon. Packag. Technol. , 29 , pp. 678 – 687 . 1521-3331 Phelan , P. E. , 2001 , “ Current and Future Miniature Refrigeration Cooling Technologies for High Power Microelectronics...
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Topics: Heating, Plates (structures), Refrigerants, Stress, Cooling, Vapors, Superheating, Two-phase flow, Pressure drop, Pressure