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Keywords: differential equations
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Journal Articles
Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 472–476.
Published Online: January 24, 2005
... packaging network topology reduced order systems linear systems differential equations The central problem in modeling of electronics systems is the handling of disparate length scales, ranging from submicron at the IC (integrated circuit) level to meters at the cabinet levels. If one extends...
Journal Articles
Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 141–146.
Published Online: July 26, 2002
... and the zero-shear stress boundary conditions at the free edges, and the interfacial peeling stress given by the present model is self-equilibrated. Remarkably, the present model leads to a fourth-order differential equation for the interfacial shear stress, and is considerably simpler than other known...