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Keywords: die-attach thermal interface materials
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031002.
Paper No: EP-18-1100
Published Online: April 10, 2019
... in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 31, 2018; final manuscript received February 7, 2019; published online April 10, 2019. Assoc. Editor: Changqing Chen. 31 10 2018 07 02 2019 die-attach thermal interface materials enhancement structures copper...
