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Keywords: diamond
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041015.
Published Online: December 9, 2010
...Hung-En Chou; Shang-Ray Yang; Sea-Fue Wang; James C. Sung As a thermal interface material, thermal grease (TG) has been extensively applied to facilitate heat dissipation in electronic devices. Despite the superior thermal conductivity of diamond, researches on diamond-containing TGs remain rare...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
Published Online: November 24, 2010
... number per unit volume. The channels had rectangular cross-sections with hydraulic diameters ranging from 0.762 mm to 1.389 mm. Acetone, water, diamond/acetone, gold/water, and diamond/water nanofluids were tested as working fluids. It was found that the FP-OHP’s thermal resistance depended on the power...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2005, 127(3): 353–356.
Published Online: October 31, 2004
...Jun Xu; Richard A. Wirtz Algebraic models of porosity, specific surface area, and in-plane effective thermal conductivity for stacked, two-dimensional symmetric diamond-weave screen laminations are developed and benchmarked with laboratory experiments. Diamond-weave laminations are found to have...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 271–276.
Published Online: July 26, 2002
...Shoji Kamiya; Hironori Takahashi; Masumi Saka; Hiroyuki Abe´ CVD diamond particles were produced on silicon substrates under various conditions such as different methane concentration in the source gas mixture and the substrate temperature. Adhesive fracture toughness of these diamond particles...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 92–97.
Published Online: September 21, 1999
... are reducing the package/junction temperature Tj and improving the integrity of the interfaces between the encapsulating polymer and the constituent package materials. CVD diamond, with its superior thermal conductivity, low density and high electrical resistivity offers an attractive alternative...