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Keywords: creep fracture
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Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 212–220.
Published Online: July 26, 2002
... analysis creep fracture chip scale packaging reflow soldering 07 August 2000 26 07 2002 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD August 7, 2000. Associate Editor: Yi-Hsin...