1-1 of 1
Keywords: creep fracture
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

John H. Lau, Fellow ASME, Stephen H. Pan, Chris Chang
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 212–220.
DOI: https://doi.org/10.1115/1.1462625
Published Online: July 26, 2002
... analysis creep fracture chip scale packaging reflow soldering 07 August 2000 26 07 2002 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD August 7, 2000. Associate Editor: Yi-Hsin...
View Article titled, A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints
Click here to open pdf in another window PDF for A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints
Topics: Corners (Structural elements), Fracture (Materials), Solder joints, Fatigue, Density, Semiconductor wafers, Cycles