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Keywords: creep analysis
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021001.
Paper No: EP-24-1080
Published Online: December 9, 2024
...) Δ ϵ eqv , Δ W = the accumulated equivalent inelastic strain μ m / m and inelastic strain energy density J / m m 3 ζ = stress multiplier lead-free soldering SAC alloys Anand viscoplasticity finite element analysis creep...
