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Keywords: copper pillar arrays
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031002.
Paper No: EP-18-1100
Published Online: April 10, 2019
... lower priority for the current work. The copper pillar array structures are gaining momentum in study for applications as thermal interface materials in recent years. Nonetheless, extensive studies in copper pillars have been used as microbump interconnects for electronics packaging applications...
