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Keywords: cooling
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
Published Online: August 17, 2020
.... It is especially important while performing rapid prototyping and quick design studies of extreme heat flux cooling devices. One of the major issues plaguing the use of laser micromachining to manufacture commercially usable devices, is the formation of debris during cutting and the difficulty in removing...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031004.
Paper No: EP-16-1037
Published Online: May 17, 2016
...Houxue Huang; Navid Borhani; John Richard Thome Multi-microchannel evaporators with flow boiling, used for cooling high heat flux devices, usually experience transient heat loads in practical applications. These transient processes may cause failure of devices due to a thermal excursion or poor...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041005.
Paper No: EP-13-1106
Published Online: September 19, 2014
... a small heat sink which is barely capable of dissipating heat for 60 W equivalent LED bulbs with natural convection for today's LED efficacies. 75 W and 100 W equivalent bulbs require larger sizes, some method of forced cooling, or some unusual liquid cooling system; generally none of these approaches...
Journal Articles
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024001.
Paper No: EP-13-1081
Published Online: April 29, 2014
...Satish G. Kandlikar The device load distribution in the above work by Koo et al. [ 24 ] considered a higher load near the exit of the channels. This helped in reducing the pressure drop. Their work clearly showed the potential of two-phase cooling using water at subatmospheric pressures directly...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
Published Online: December 9, 2011
... such as water or the like. In this paper, utilizing thermosyphon effect to drive room temperature liquid metal for electronic cooling was proposed for the first time with its technical feasibility demonstrated. This may lead to a self supported cooling which just utilizes the waste heat produced by the hot chip...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041005.
Published Online: December 9, 2011
... of downhole electronics at an ambient temperature of 200–250 °C. It was observed that the ability of the thermal management system to keep electronics cool varied from 30 °C to a few degrees below the surrounding temperature, for chip wattage varying from 0 W to 8 W, respectively. Heat from electronic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041001.
Published Online: November 17, 2011
...Jing He; Liping Liu; Anthony M. Jacobi Thermal analysis with comprehensive treatment of conjugate heat transfer is performed in this study for discrete flush-mounted heat sources in a horizontal channel cooled by air. The numerical model accounts for mixed convection, radiative exchange and two...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031013.
Published Online: September 30, 2011
... planes. So, to optimize board cooling, the designer has more and more to deal with PCB architecture including high density interconnect (HDI) technology, which relies on small diameter laser drilled micro-vias. Compared with conventional PCB technologies, HDI creates denser interconnect substrates...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
...Ed J. Walsh; Thomas J. Breen; Jeff Punch; Amip J. Shah; Cullen E. Bash The chiller cooled data center environment consists of many interlinked elements that are usually treated as individual components. This chain of components and their influences on each other must be considered in determining...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031003.
Published Online: September 14, 2011
...Huy N. Phan; Dereje Agonafer Comprehensive analysis of microelectronic cooling systems utilizing thermoelectric modules is time consuming because it involves solving many parametric equations, which require solving complex mathematical equations or the assistance of an expensive computation-fluid...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031006.
Published Online: September 14, 2011
...M. O. Özdemir; H. Yüncü The objective of this study is to predict numerically the optimal spacing between parallel heat generating boards. The isothermal boards are stacked in a fixed volume of electronic package enclosed by insulated lateral walls, and they are cooled by laminar forced convection...
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2011, 133(1): 010301.
Published Online: March 10, 2011
... was created for an opto-electronic package, and validated by experiments. The presented method gives a very good case study for such exercises. In the paper of Martinez-Galvan et al., “Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a,” experimental measurements...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011006.
Published Online: March 9, 2011
... brightness computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) light-emitting diode printed circuit board LED array thermal modeling Light-emitting diodes (LEDs) demonstrate a number...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
Published Online: March 9, 2011
.... Schematic of the four-finger InGaP/GaAs C-up HBT with a thermal-via configuration 29 05 2010 03 12 2010 09 03 2011 09 03 2011 cooling gallium arsenide gallium compounds genetic algorithms heterojunction bipolar transistors III-V semiconductors indium compounds...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011007.
Published Online: March 9, 2011
... a thermal management perspective. Considerable ongoing research efforts focus on optimizing the room layouts and equipment design in order to achieve the desired cooling. However, the detrimental impact of underfloor blockages, which occur widely, is seldom addressed. These blockages often take the form...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011002.
Published Online: March 3, 2011
...Eduardo Martínez-Galván; Juan Carlos Ramos; Raúl Antón; Rahmatollah Khodabandeh Experimental measurements in a spray cooling test rig have been carried out for several heat fluxes in the heater and different spray volumetric fluxes with the dielectric refrigerant R134a. Results of the heat transfer...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011001.
Published Online: March 2, 2011
...Tannaz Harirchian; Suresh V. Garimella Flow boiling in microchannels has been investigated extensively over the past decade for electronics cooling applications; however, the implementation of microchannel heat sinks operating in the two-phase regime in practical applications has lagged due...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041004.
Published Online: November 23, 2010
... of the module, focusing in particular on the heat diffusion time and R C thermal time constant. Based on the material properties reported in the literature, we project that cooling power densities > 10 W / cm 2 may be achieved across Δ T of the order of 10 K at coefficient of performance (COP) > 10...