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Journal Articles

Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Open Access
Ercan M. Dede, Feng Zhou, Yuqing Zhou, Danny J. Lohan, Mehdi Asheghi, Kenneth E. Goodson, Kris Erickson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021009.
Paper No: EP-24-1066
https://doi.org/10.1115/1.4067649
Published Online: February 20, 2025
..., ceramic, and composite), and electronics package integration approaches, or conceptual fabrication workflows, are outlined for cold plates, heat sinks, fluid flow manifolds, and thermal interface materials (TIMs) plus composites for electronics. The current status of design optimization methods for AM...
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Topics: Additive manufacturing, Ceramics, Design, Electronics, Heat sinks, Manifolds, Manufacturing, Metals, Polymers, Cooling
Journal Articles

Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Available to Purchase
Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 188–191.
https://doi.org/10.1115/1.1477191
Published Online: July 26, 2002
... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD May 3, 2001. Associate Editor: Z. Suo. 03 May 2001 26 07 2002 filled polymers particle reinforced composites thermal resistance packaging cooling Polymer...
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Topics: Boron, Contact resistance, Lithium, Particulate matter, Ions, Sodium, Silicones, Solders, Thermal conductivity, Water
Journal Articles

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Available to Purchase
Xiangcheng Luo,, Yunsheng Xu, and, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2001, 123(3): 309–311.
https://doi.org/10.1115/1.1371925
Published Online: June 26, 2000
... Interface Thermal Contact Thermal Conductance Composite Silicone Polyethylene Glycol Sodium Silicate Boron Nitride Thermal contacts are commonly encountered. An example is the thermal contact between a printed circuit board and a heat sink 1 2 . The quality of a thermal contact...
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Topics: Contact resistance, Copper, Cycles, Disks, Electrical conductance, Heating, Silicones, Sodium, Thermal conductivity, Thermal stability