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Keywords: circuit layout CAD
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 115–120.
Published Online: November 9, 1999
.... 09 November 1999 thermal management (packaging) temperature distribution multichip modules circuit reliability finite element analysis circuit layout CAD Thermal management is an important consideration in Multichip Module (MCM). Since high power is to be dissipated over...