... 0.002305 0.002256 29 11 2009 25 09 2010 08 12 2010 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder wetting...

... and with the temperature degrading at the same pressure. In the COG packaging with NCF, a proper elevating of the bonding temperature could produce a stable direct connection with the low contact resistance. 24 02 2010 24 09 2010 03 12 2010 03 12 2010 chip-on-board packaging contact resistance...

.../ACFs) or the nonconductive adhesives/films (NCAs/NCFs), and the former is more widely used than the latter. nonconductive film (NCF) chip on glass (COG) warpage the thermocompression bonding chip-on-board packaging thermal stresses 08 11 2008 26 05 2008 29 10 2009...

... conducted by: Y. C. Chan. Packaging. 01 October 2003 06 January 2004 15 November 2004 03 06 2005 chip-on-board packaging integrated circuit packaging light interferometry integrated circuit testing integrated circuit reliability integrated circuit interconnections flip...

.... Review conducted by: C. Basaran. 24 October 2004 17 May 2004 03 06 2005 ceramic packaging strain ageing chip-on-board packaging integrated circuit packaging integrated circuit reliability integrated circuit interconnections printed circuits solders thermal stress...

... packaging adhesives chip scale packaging adhesive bonding encapsulation integrated circuit reliability chip-on-board packaging Many simple processes for flip chip assemblies at low costs have been developed 1 2 3 4 5 . There are many options to select from for a particular application...

.... ball grid arrays plastic packaging chip-on-board packaging flip-chip devices integrated circuit packaging thermal management (packaging) thermal conductivity natural convection forced convection thermal resistance 26 April 2004 23 June 2004 24 01 2005 Paper presented...

... employing epoxy resin filled between chip and FR4 substrate, comparing with using ceramic substrate only. J -integral Flip-chip Interfacial delamination Crack propagation Finite element simulation cracks inspection failure analysis chip-on-board packaging flip-chip devices...

... by the EPPD Division, January 25, 2002; revised manuscript received March 15, 2002. Associate Editor: D. T. Read. 25 January 2002 15 March 2002 14 03 2003 tin alloys lead alloys flip-chip devices chip-on-board packaging soldering thermal stress cracking plastic deformation...

... Editor: A. Tay. 01 April 2001 20 April 2002 12 12 2002 encapsulation flip-chip devices chip-on-board packaging integrated circuit packaging plastic packaging polymer films heat treatment differential scanning calorimetry The reliability of flip chip on board (FCOB...

...-on-board packaging reflow soldering swelling environmental degradation viscoplasticity life testing finite element analysis ageing thermal stress cracking integrated circuit interconnections The direct attachment of a flip chip die to an organic substrate with eutectic (63Sn/37Pb) solder...

... for minimizing edge stresses in IC packages are presented. [S1043-7398(00)00904-X] Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associated Technical Editor: M. Shiratori. flip-chip devices chip-on-board packaging integrated...

... Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters October 10, 2000. Associate Editor: J. Lau 10 October 2000 flip-chip devices chip-on-board packaging chip scale packaging...

... 17 18 19 ) are measured and calculated in the lab coordinate. By the method given in the previous section, the principal curvatures can be further determined. A flip-chip-on-board package was used as a test vehicle. Its structure is shown in Fig. 6 . The underfill material is silica-filled...

... August 1999 semiconductor device packaging flow simulation finite element analysis microprocessor chips compressible flow encapsulation viscosity chip-on-board packaging Semiconductor chips are often encapsulated with an epoxy-molding compound (EMC) for protection and optimal use...