... modeling, that address the nature of the singular solutions at the crack tip and provide insight when dealing with the more complex problem of solder joint fracture. Using three-dimensional finite element analysis of a chip scale package, we systematically examine the stress-strain behavior at the edge...

...Jose Omar S. Amistoso; Alberto V. Amorsolo, Jr. Cold bump pull tests performed on wafer level chip scale packages using SAC105 solder bumps show an increase in the occurrence of brittle failure modes with aging temperature and time. Fast intermetallic growth at 0–1000 h can be attributed to ( Cu...

.... , 2002 , Mechanical Vibration & Shock Volume II: Mechanical Shock , Hermes Penton Ltd. , New York . 31 07 2008 03 06 2009 21 10 2009 atomic clocks chip scale packaging clocks displacement measurement finite element analysis surface emitting lasers temperature...

... PWBs during convective reflow processes. 13 01 2008 05 11 2008 01 04 2009 ball grid arrays chip scale packaging plastic packaging Over the past several decades, electronic packaging technology has been evolving rapidly. The next generation packaging involves dramatic...

...Jin Yang; I. Charles Ume Microelectronics packaging technology has evolved from through-hole and bulk configurations to surface-mount and small-profile configurations. Surface mount devices, such as flip chip packages, chip scale packages, and ball grid arrays, use solder bump interconnections...

... measurement ceramic capacitors chip scale packaging crack detection failure analysis finite element analysis reliability surface mount technology system-in-package Multilayer ceramic chip capacitors are often used as integrated passives in, e.g., system in package (SIP) applications due...

... Performance Prediction and Application for Design Optimization of Chip Scale Packages ,” Proceedings of the 55th Electronic Components and Technology Conference , pp. 472 – 479 . Zhu , L. , and Marcinkiewicz , W. , 2005 , “ Drop Impact Reliability Analysis of CSP Packages at Board and Product...

... with fatigue reliability of a thin-profile fine-pitch ball grid array chip-scale package subjected to power cycling. The numerical model was calibrated using steady-state and power cycling experiments. Following the calibrated numerical model, different power cycling durations on the thermal characteristics...

... through experimentation and finite element analysis. atomic clocks bimetals chip scale packaging discs (structures) heat conduction switches temperature control thermal management (packaging) The experiment was run once each for the corner and side resistors in air and vacuum; results...

... for stacked packages, which tend to require longer wires and more complex looping shapes relative to what is required for comparable discrete chip-scale packages. Additionally, Tay et al. ( 6 ) have shown via finite element analysis that a downset die—where...

...Wen-Ren Jong; Hsin-Chun Tsai; Hsiu-Tao Chang; Shu-Hui Peng In this study, the effects of the temperature cyclic loading on three lead-free solder joints of 96.5Sn–3.5Ag, 95.5Sn–3.8Ag-0.7Cu, and 95.5Sn–3.9Ag-0.6Cu bumped wafer level chip scale package (WLCSP) on printed circuit board assemblies...

... thermal cycles (e.g., 2000 cycles with no failure or 2500 cycles with less than 1% failure rate). automotive electronics ball grid arrays chip scale packaging integrated circuit interconnections integrated circuit reliability printed circuits 29 12 2004 07 03...

...Yi-Shao Lai; Chang-Lin Yeh; Ching-Chun Wang We present in this paper parametric studies of board-level reliability of wafer-level chip-scale packages subjected to a specific pulse-controlled drop test condition. Eighteen experiment cells, constructed by varying joint pitch, die thickness, and die...

... such as ball grid array (BGA) and chip-scale package (CSP) assemblies are being used in double-sided configurations for network and memory device applications as they reduce the routing space and improve electrical performance ( Shiah, A. C., and Zhou, X., 2002, “A Low Cost Reliability Assessment for Double...

...Tong Hong Wang; Chang-Chi Lee; Yi-Shao Lai; Yu-Cheng Lin In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient thermal analysis. Tabular boundary conditions...

... 03 06 2005 silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance...

... possible configurations for the solution presented. 29 07 2004 18 05 2005 heat sinks thermal management (packaging) chip scale packaging heat conduction thermal conductivity microprocessor chips Thermal management of electronic packages and systems is one of the key technical...

... Science Foundation of China under Grant No. 90207013 and 985 project of Peking University, China. silicon conducting polymers micromechanical devices micromachining adhesive bonding fluorescence Raman spectra chip scale packaging photoresists DNA PCR Microchip Array Polymer...

... have an increasing selection of possible flip chip assembly processes, based primarily on cost, reliability and complexity. flip-chip devices integrated circuit packaging adhesives chip scale packaging adhesive bonding encapsulation integrated circuit reliability chip-on-board packaging...

... solutions based on a duromer MID approach. Manuscript received January 6, 2004; revision received June 24, 2004. Review conducted by: Y. C. Chan. 06 January 2004 24 June 2004 21 03 2005 chip scale packaging encapsulation integrated circuit interconnections integrated circuit...