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Keywords: ceramics
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011012.
Published Online: February 14, 2008
... components under vibration conditions. In particular, this paper discusses the out-of-plane sinusoidal vibration experiments at 1 G , numerical modeling, and fatigue life prediction for a 42.5 × 42.5 × 4 mm 3 1089 input∕output ceramic column grid array (CCGA) package on a 133 × 56 × 2.8 mm 3 FR4 board...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 469–472.
Published Online: April 4, 2007
...Hong He; Renli Fu; Yanchun Han; Yuan Shen; Deliu Wang Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that is not cost effective enough. In this study, Si 3...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 26–33.
Published Online: April 30, 2004
...Anatoly E. Rokhvarger; Lubov A. Chigirinsky Recently awarded U.S. patents and proven in the lab, our versatile high temperature superconductor (HTS) ceramic nanotechnology utilizes a novel material formulation of nanosize HTS ceramic powder and of multi-purpose silicone polymer additive...