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Keywords: ceramic
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Journal Articles
Ercan M. Dede, Feng Zhou, Yuqing Zhou, Danny J. Lohan, Mehdi Asheghi, Kenneth E. Goodson, Kris Erickson
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021009.
Paper No: EP-24-1066
Published Online: February 20, 2025
..., ceramic, and composite), and electronics package integration approaches, or conceptual fabrication workflows, are outlined for cold plates, heat sinks, fluid flow manifolds, and thermal interface materials (TIMs) plus composites for electronics. The current status of design optimization methods for AM...
Journal Articles
Packaging of Optical MEMS Devices
Available to PurchaseYee L. Low, Ronald E. Scotti, David A. Ramsey, Cristian A. Bolle, Steven P. O’Neill, Khanh C. Nguyen
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 325–328.
Published Online: September 17, 2003
... into consideration, we explore three ceramic packaging technologies, namely high-temperature co-fired ceramic (HTCC), low-temperature co-fired ceramic (LTCC), and thin-film ceramic technologies. In this paper, we describe some optical MEMS packages designed using these three technologies and discuss their substrate...
