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Keywords: aerosol jet printing
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Journal Articles

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Pradeep Lall, Sabina Bimali, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041116.
Paper No: EP-24-1029
https://doi.org/10.1115/1.4066041
Published Online: August 17, 2024
... × 0.60 mm Inductor 0806 2.2  μ H @ 7.96 MHz 2.00 mm × 1.6 mm × 1.80 mm Capacitor 0805 1  μ F @ 1 kHz 2.00 mm × 1.25 mm × 01.45 mm e-mail:  lall@auburn.edu 01 02 2024 29 06 2024 17 08 2024 flexible printing substrates aerosol jet printing...
View Article titled, Process Recipe and Functional Circuitry Performance on <span class="search-highlight">Aerosol</span> <span class="search-highlight">Jet</span> <span class="search-highlight">Printed</span> Water-Based Silver Ink
Open the PDF for Process Recipe and Functional Circuitry Performance on <span class="search-highlight">Aerosol</span> <span class="search-highlight">Jet</span> <span class="search-highlight">Printed</span> Water-Based Silver Ink in another window
Topics: Circuits, Design, Inks, Printing, Shear (Mechanics), Silver, Sintering, Aerosols, Stress, Water
Journal Articles

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021117.
Paper No: EP-21-1066
https://doi.org/10.1115/1.4053766
Published Online: March 11, 2022
... with the realized performance. Aerosol Jet printing technology has garnered increased interest, owing to a noncontact nature of print process and the high standoff allowing for printing on nonplanar surfaces. Prior efforts with aerosol-jet printing have focused on single-layer substrates. The current efforts focus...
View Article titled, Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using <span class="search-highlight">Aerosol</span>-<span class="search-highlight">Jet</span> <span class="search-highlight">Printed</span> Dielectric Vias
Open the PDF for Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using <span class="search-highlight">Aerosol</span>-<span class="search-highlight">Jet</span> <span class="search-highlight">Printed</span> Dielectric Vias in another window
Topics: Aerosols, Failure, Inks, Printing, Shear (Mechanics), Sintering, Stress, Vehicles, Temperature, Silver
Journal Articles

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031121.
Paper No: EP-20-1008
https://doi.org/10.1115/1.4047844
Published Online: August 7, 2020
... electronics and reliability data for various use conditions. In this paper, a test protocol has been developed for twisting and flexing on aerosol-jet additively printed flexible circuits. Test patterns with commonly used traces geometries have been developed, aerosol-jet printed, and thermally sintered...
View Article titled, Flexure and Twist Test Reliability Assurance of Flexible Electronics
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Topics: Bending (Stress), Cycles, Failure, Reliability, Sintering, Temperature, Inks, Flexible electronics, Testing, Printing