Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-4 of 4
Keywords: additive manufacturing
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041103.
Paper No: EP-23-1032
Published Online: October 9, 2023
... spacing. A parametric experimental investigation is performed as a point of comparison using a modular, additively manufactured jet setup. Computational simulations are used to evaluate the effect of jet configuration on stagnation pressure associated with maximum heat transfer rates, and an empirical...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011103.
Paper No: EP-22-1013
Published Online: October 22, 2022
...J. C. C. Lo; Q. Jiang; X. Qiu; N. Tu Redistribution layer (RDL) is one key enabling technology for advanced packaging. RDL is usually fabricated at wafer level by a photolithography process. An alternative approach for implementing RDL by additive manufacturing (AM) method is proposed in this study...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014501.
Paper No: EP-19-1040
Published Online: September 19, 2019
... into play. Currently, the interposers are mainly made of silicon or glass, which incur huge additional costs to the packaged components. In this study, the unique advantages of additive manufacturing (AM) are exploited to realize organic interposers. The proposed interposers provide easy signal probing...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031004.
Paper No: EP-13-1041
Published Online: September 1, 2015
... conductivity of the conductive path without inducing damage to the substrate. The 3D via/interconnect structure was routed within 3D polymeric substrates and had external and internal sections. The 3D structures were created by the additive manufacturing (AM) process of stereolithography (SL) and were designed...