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Keywords: Wire Density Effect
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Journal Articles

Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect

Chien-Chang Pei, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 335–339.
https://doi.org/10.1115/1.1939028
Published Online: November 3, 2004
... and, hence, on the amount of wire sweep. In most mold flow simulations, the wire density effect is ignored. In order to consider the wire density effect on the predicted amount of wire sweep in the analysis, several indirect approaches were used by researchers before. But those approaches were not general...
View Article titled, Prediction of Wire Sweep During the Encapsulation of IC Packaging With <span class="search-highlight">Wire</span> <span class="search-highlight">Density</span> <span class="search-highlight">Effect</span>
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Topics: Density, Wire, Flow (Dynamics)