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Keywords: Transfer Molding
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Journal Articles

Three-Dimensional Paddle Shift Modeling for IC Packaging

Chien-Chang Pei, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
https://doi.org/10.1115/1.1938986
Published Online: December 2, 2004
... and Validation of the Encapsulation of Plastic Packages by Transfer Molding ,” ASME J. Electron. Packag. 1043-7398 10.1115/1.483146 , 122 , pp. 138 – 146 . Su , F. , Hwang , S.-J. , Lee , H.-H. , and Huang , D.-Y. , 2000 , “ Prediction of Paddle Shift via 3D TSOP Modeling ,” IEEE...
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Topics: Computation, Deflection, Flow (Dynamics), Fluid dynamics, Geometry, Integrated circuit packaging, Integrated circuits, Mesh generation, Modeling, Molding
Journal Articles

Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect

Chien-Chang Pei, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 335–339.
https://doi.org/10.1115/1.1939028
Published Online: November 3, 2004
... effect. 14 07 2004 03 11 2004 plastic packaging integrated circuit packaging transfer moulding encapsulation polymers integrated circuit modelling Wire Density Effect Wire Sweep Mold-Filling Analysis Transfer Molding Plastic Packaging of ICs Plastic Encapsulation...
View Article titled, Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect
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Topics: Density, Wire, Flow (Dynamics)