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Keywords: Solder Joints
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Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
https://doi.org/10.1115/1.4003992
Published Online: June 23, 2011
... imaging thermal fatigue life prediction crack propagation phase growth solder joints flip chip, nondestructive inspection x-ray microtomography synchrotron radiation. In electronic devices and components, one issue of particular importance is the electrical and mechanical reliability...
View Article titled, Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
Open the PDF for Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects in another window
Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging
Journal Articles

Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model

Mudasir Ahmad, Ken Hubbard, Mason Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 290–298.
https://doi.org/10.1115/1.1938985
Published Online: October 5, 2004
...Mudasir Ahmad; Ken Hubbard; Mason Hu Ball grid array solder joint reliability is known to be dependent on the shape of solder joints after reflow. To ensure good solder joint formation and prevent solder bridging, it is critical to understand the amount of paste volume needed during assembly...
View Article titled, <span class="search-highlight">Solder</span> <span class="search-highlight">Joint</span> Shape Prediction Using a Modified Perzyna Viscoplastic Model
Open the PDF for <span class="search-highlight">Solder</span> <span class="search-highlight">Joint</span> Shape Prediction Using a Modified Perzyna Viscoplastic Model in another window
Topics: Shapes, Solder joints, Solders, Surface tension, Warping, Finite element analysis, Ball-Grid-Array packaging
Journal Articles

Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions

Tae-Sang Park, Soon-Bok Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 237–244.
https://doi.org/10.1115/1.1871192
Published Online: May 26, 2004
...Tae-Sang Park; Soon-Bok Lee To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were conducted with 63 Sn ∕ 37 Pb and Sn ∕ 3.5 Ag ∕ 0.75 Cu solder joints in room...
View Article titled, Low Cycle Fatigue Testing of Ball Grid Array <span class="search-highlight">Solder</span> <span class="search-highlight">Joints</span> under Mixed-Mode Loading Conditions
Open the PDF for Low Cycle Fatigue Testing of Ball Grid Array <span class="search-highlight">Solder</span> <span class="search-highlight">Joints</span> under Mixed-Mode Loading Conditions in another window
Topics: Ball-Grid-Array packaging, Displacement, Fatigue life, Fatigue testing, Low cycle fatigue, Solder joints, Solders, Stress, Testing, Tin