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Keywords: Plastic Encapsulation
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
Published Online: December 2, 2004
... Molding Plastic Packaging of ICs Plastic Encapsulation With the high popularity of electronic products, the development rate of new technology in the electronics industry is rapid, and the design trend for electronic products is toward lower weight and smaller size. In order to fabricate slim...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 335–339.
Published Online: November 3, 2004
... effect. 14 07 2004 03 11 2004 plastic packaging integrated circuit packaging transfer moulding encapsulation polymers integrated circuit modelling Wire Density Effect Wire Sweep Mold-Filling Analysis Transfer Molding Plastic Packaging of ICs Plastic Encapsulation...