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Keywords: Plastic BGA
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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
Published Online: March 14, 2003
... brittle nature and microstructural mismatch with Sn-Pb solder and copper, too thick an IMC layer will cause the interface in the solder joint to be more sensitive to stress 1 2 . Plastic BGA Solder Joint Cooling Rate Cu-Sn Intermetallics Intermetallic Compound Growth copper alloys...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
Published Online: July 14, 1999
.../O. This trend has put increased emphasis on microelectronic packaging. Ball grid array (BGA) has become the package of choice. Plastic BGA Solder Joint Reliability Cooling Rate Solidification Shear Cycle Test and Fatigue Life plastic packaging ball grid arrays thermal stress...