Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-2 of 2
Keywords: Plastic BGA
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
Published Online: March 14, 2003
... brittle nature and microstructural mismatch with Sn-Pb solder and copper, too thick an IMC layer will cause the interface in the solder joint to be more sensitive to stress 1 2 . Plastic BGA Solder Joint Cooling Rate Cu-Sn Intermetallics Intermetallic Compound Growth copper alloys...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
Published Online: July 14, 1999
.../O. This trend has put increased emphasis on microelectronic packaging. Ball grid array (BGA) has become the package of choice. Plastic BGA Solder Joint Reliability Cooling Rate Solidification Shear Cycle Test and Fatigue Life plastic packaging ball grid arrays thermal stress...
