1-2 of 2
Keywords: Cooling Rate
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
Published Online: July 14, 1999
... that increasing conveyor speed increases the cooling rate during solder solidification. SEM micrographs reveal that cracks initiated at the acute point near the PCB solder pad, then propagate along the interface of the bulk solder/IMC layer. The test results are ascribed to roughing interface of the bulk solder...