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Journal Articles

Multiphysics Coupling in IGBT Modules: A Review

Weiqiang Tian, Naichao Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2024, 146(4): 040801.
Paper No: EP-24-1009
https://doi.org/10.1115/1.4065941
Published Online: July 26, 2024
View Article titled, Multiphysics Coupling in IGBT Modules: A Review
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Topics: Insulated-gate bipolar transistors, Temperature
Journal Articles

A Review of Mechanism and Technology of Hybrid Bonding

Yipeng Xu, Yanping Zeng, Yi Zhao, Choonghyun Lee, Minhui He, Zongfang Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2025, 147(1): 010801.
Paper No: EP-23-1084
https://doi.org/10.1115/1.4065650
Published Online: July 25, 2024
View Article titled, A Review of Mechanism and Technology of Hybrid Bonding
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Topics: Bonding
Journal Articles

Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

Yuan Chen, Zhongyang Wang, Yuhui Fan, Ming Dong, Dengxue Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2024, 146(3): 030801.
Paper No: EP-23-1037
https://doi.org/10.1115/1.4064361
Published Online: March 8, 2024
View Article titled, Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging
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Topics: Imaging, Inspection, Lasers, Microelectronic packaging, Resolution (Optics), Nondestructive evaluation, Microscopy
Journal Articles

Hybrid Bonding for Ultra-High-Density Interconnect

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2024, 146(3): 030802.
Paper No: EP-23-1064
https://doi.org/10.1115/1.4064750
Published Online: March 8, 2024
View Article titled, Hybrid Bonding for Ultra-High-Density Interconnect
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Topics: Bonding, Semiconductor wafers, Copper, Overlays (Materials engineering), Design
Journal Articles

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Tolga Emir, Hamza Ourabi, Mete Budakli, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2022, 144(4): 040801.
Paper No: EP-21-1129
https://doi.org/10.1115/1.4054184
Published Online: April 28, 2022
View Article titled, Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review
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Topics: Boiling, Bubbles, Critical heat flux, Heat transfer, Pool boiling, Pressure, Nucleation (Physics), Fluids, Water, Heat
Journal Articles

Recent Developments in Air Pumps for Thermal Management of Electronics

Tsrong-Yi Wen, Jia-Cheng Ye
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030802.
Paper No: EP-20-1109
https://doi.org/10.1115/1.4051970
Published Online: October 1, 2021
View Article titled, Recent Developments in Air Pumps for Thermal Management of Electronics
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Topics: Pumps, Flow (Dynamics), Diaphragms (Mechanical devices), Diaphragms (Structural), Fans, Electronics, Cooling
Journal Articles

Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review

Satyam Saini, Jimil M. Shah, Pardeep Shahi, Pratik Bansode, Dereje Agonafer, Prabjit Singh, Roger Schmidt, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030801.
Paper No: EP-20-1054
https://doi.org/10.1115/1.4051255
Published Online: September 15, 2021
View Article titled, Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review
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Topics: Contamination, Corrosion, Data centers, Particulate matter, Reliability, Temperature, Copper, Silver, Failure
Journal Articles

A Review on Transient Thermal Management of Electronic Devices

John Mathew, Shankar Krishnan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010801.
Paper No: EP-20-1113
https://doi.org/10.1115/1.4050002
Published Online: August 6, 2021
View Article titled, A Review on Transient Thermal Management of Electronic Devices
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Topics: Cooling, Heat, Heat pipes, Phase change materials, Temperature, Thermal management, Transients (Dynamics), Vapors, Boiling, Steady state
Journal Articles

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

Ruina Xu, Gaoyuan Wang, Peixue Jiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010802.
Paper No: EP-20-1114
https://doi.org/10.1115/1.4050046
Published Online: August 6, 2021
View Article titled, Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms
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Topics: Cooling, Heat transfer, Sprays, Critical heat flux, Drops
Journal Articles

Underfill Flow in Flip-Chip Encapsulation Process: A Review

Fei Chong Ng, Mohamad Aizat Abas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010803.
Paper No: EP-21-1007
https://doi.org/10.1115/1.4050697
Published Online: August 6, 2021
View Article titled, Underfill Flow in Flip-Chip Encapsulation Process: A Review
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Topics: Flow (Dynamics), Flip-chip, Fluids, Optimization, Design, Reliability
Journal Articles

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Ali Nematollahisarvestani, Yung-Cheng “Y. C.” Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020802.
Paper No: EP-20-1043
https://doi.org/10.1115/1.4048011
Published Online: September 3, 2020
View Article titled, A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones
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Topics: Buckling, Deformation, Delamination, Failure, Fracture (Materials), Fracture (Process), Patents, Stress, Coatings
Journal Articles

State of the Art of Lead-Free Solder Joint Reliability

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020803.
Paper No: EP-20-1059
https://doi.org/10.1115/1.4048037
Published Online: September 3, 2020
View Article titled, State of the Art of Lead-Free Solder Joint Reliability
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Topics: Alloys, Creep, Failure, Reliability, Solder joints, Solders, Temperature, Viscoplasticity, Lead-free solders, Stress
Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020801.
Paper No: EP-20-1074
https://doi.org/10.1115/1.4048038
Published Online: August 27, 2020
View Article titled, Review of Methodologies for Structural Integrity Evaluation of Power Modules
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Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire