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Journal Articles

Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures

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Nobuyuki Shishido, Yutaka Hayama, Yuki Akinaga, Shinya Taketomi, Masaaki Koganemaru, Seiya Hagihara, Noriyuki Miyazaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011010.
Paper No: EP-24-1039
https://doi.org/10.1115/1.4066100
Published Online: August 24, 2024
View Articletitled, Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
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Topics: Creep, Cycles, Fatigue, Fracture (Materials), Fracture mechanics, Temperature, Wire, Computational methods, Finite element analysis
Journal Articles

Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density

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Haibin Zhang, Quan Sun, Zhidan Sun, Yebo Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021006.
Paper No: EP-22-1017
https://doi.org/10.1115/1.4055469
Published Online: September 28, 2022
View Articletitled, Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density
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Topics: Current density, Silver, Wire, Temperature gradient, Electrodiffusion
Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

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Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020801.
Paper No: EP-20-1074
https://doi.org/10.1115/1.4048038
Published Online: August 27, 2020
View Articletitled, Review of Methodologies for Structural Integrity Evaluation of Power Modules
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Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire
Journal Articles

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

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Alexander Otto, Sven Rzepka, Bernhard Wunderle
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031012.
Paper No: EP-18-1098
https://doi.org/10.1115/1.4043646
Published Online: June 17, 2019
View Articletitled, Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices
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Topics: Cycles, Failure, Junctions, Temperature, Wire, Stress, Failure mechanisms, Thermomechanics
Journal Articles

Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition

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Guicui Fu, Maogong Jiang, Bo Wan, Yanruoyue Li, Cheng Ma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011004.
Paper No: EP-18-1055
https://doi.org/10.1115/1.4041984
Published Online: February 25, 2019
View Articletitled, Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition
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Topics: Bonding, Shock (Mechanics), Wire, Risk assessment
Journal Articles

A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices

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Liang Yin, Christopher Kapusta, Arun Gowda, Kaustubh Nagarkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031009.
Paper No: EP-17-1113
https://doi.org/10.1115/1.4040499
Published Online: July 2, 2018
View Articletitled, A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices
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Topics: Overlays (Materials engineering), Packaging, Power semiconductor devices, Reliability, Silicon, Wire, Gates (Closures), Manufacturing, Temperature, Heat sinks
Journal Articles

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

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Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2018, 140(1): 017001.
Paper No: EP-17-1111
https://doi.org/10.1115/1.4038735
Published Online: March 2, 2018
View Articletitled, Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]
Open the PDF for Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ] in another window
Topics: Bridges (Structures), Electrons, Sensors, Silicon, Stress, Wire
Journal Articles

Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages

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Huang-Kuang Kung, Chi-Lung Hsieh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041002.
Paper No: EP-17-1042
https://doi.org/10.1115/1.4037276
Published Online: July 27, 2017
View Articletitled, Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages
Open the PDF for Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages in another window
Topics: Wire, Deflection
Journal Articles

Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process

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Tzeng Yih-Fong, Chen Fu-Chen, Chen Chih-Huang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041004.
Paper No: EP-14-1080
https://doi.org/10.1115/1.4031471
Published Online: October 1, 2015
View Articletitled, Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process
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Topics: Ball-Grid-Array packaging, Optimization, Principal component analysis, Shear strength, Wire, Wire bonding, Design, Performance evaluation, Process design
Journal Articles

Modeling and Experimental Study of a Wire Clamp for Wire Bonding

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Fuliang Wang, Dengke Fan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011012.
Paper No: EP-14-1035
https://doi.org/10.1115/1.4028836
Published Online: March 1, 2015
View Articletitled, Modeling and Experimental Study of a Wire Clamp for Wire Bonding
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Topics: Clamps (Tools), Wire, Wire bonding
Journal Articles

Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method

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S. Kim, M. Mayer, J. Persic, J. T. Moon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011002.
Paper No: EP-13-1089
https://doi.org/10.1115/1.4028281
Published Online: October 6, 2014
View Articletitled, Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method
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Topics: Temperature, Wire
Journal Articles

Special Section on InterPACK 2013

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Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Articletitled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Experimental and Modeling Studies of Looping Process for Wire Bonding

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Fuliang Wang, Yun Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041009.
Paper No: EP-13-1070
https://doi.org/10.1115/1.4025667
Published Online: November 18, 2013
View Articletitled, Experimental and Modeling Studies of Looping Process for Wire Bonding
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Topics: Wire, Materials properties, Finite element model
Journal Articles

Variable-Length Link-Spring Model for Kink Formation During Wire Bonding

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Fuliang Wang, Weidong Tang, Junhui Li, Lei Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041004.
Paper No: EP-12-1061
https://doi.org/10.1115/1.4025308
Published Online: September 19, 2013
View Articletitled, Variable-Length Link-Spring Model for Kink Formation During Wire Bonding
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Topics: Springs, Wire, Wire bonding, Deformation
Journal Articles

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

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C. L. Gan, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021010.
Paper No: EP-12-1099
https://doi.org/10.1115/1.4024013
Published Online: April 12, 2013
View Articletitled, Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
Open the PDF for Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging in another window
Topics: High temperature, Packaging, Reliability, Stress, Wire, Failure mechanisms, Temperature, Semiconductors (Materials), Nanoscale phenomena, Nanoelectronics
Journal Articles

Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules

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Pushparajah Rajaguru, Stoyan Stoyanov, Hua Lu, Chris Bailey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021009.
Paper No: EP-12-1043
https://doi.org/10.1115/1.4024056
Published Online: April 12, 2013
View Articletitled, Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules
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Topics: Aluminum, Design, Optimization, Wire, Warping, Finite element analysis, Reliability, Failure
Journal Articles

Development of Accelerated Method for Thermal Cycling in Electronic Packaging Application

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Michael Mayer, Michael McCracken, John Persic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021007.
Paper No: EP-12-1096
https://doi.org/10.1115/1.4023911
Published Online: March 28, 2013
View Articletitled, Development of Accelerated Method for Thermal Cycling in Electronic Packaging Application
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Topics: Temperature, Wire, Cycles, Polysilicon
Journal Articles

Direct-Write Stretchable Sensors Using Single-Walled Carbon Nanotube/Polymer Matrix

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Morteza Vatani, Yanfeng Lu, Kye-Shin Lee, Ho-Chan Kim, Jae-Won Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011009.
Paper No: EP-12-1041
https://doi.org/10.1115/1.4023293
Published Online: February 26, 2013
View Articletitled, Direct-Write Stretchable Sensors Using Single-Walled Carbon Nanotube/Polymer Matrix
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Topics: Sensors, Single-walled carbon nanotubes, Polymers, Wire, Electronics
Journal Articles

Pull Force and Displacement of Cu/Au Wire Interconnects

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J. Lau, S. Wu, J. M. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041002.
https://doi.org/10.1115/1.4007233
Published Online: August 29, 2012
View Articletitled, Pull Force and Displacement of Cu/Au Wire Interconnects
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Topics: Displacement, Wire
Journal Articles

On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator

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Wuwei Feng, Qingfeng Meng, Youbo Xie, Hong Fan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041002.
https://doi.org/10.1115/1.4002900
Published Online: November 19, 2010
View Articletitled, On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator
Open the PDF for On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator in another window
Topics: Bonding, Feature extraction, Signals, Wire bonding, Generators, Principal component analysis, Wire, Damping, Artificial neural networks, Shear strength