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Journal Articles

Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications

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A. Polyakov, M. Bartek, J. N. Burghartz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 7–11.
https://doi.org/10.1115/1.1846059
Published Online: March 21, 2005
View Articletitled, Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications
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Topics: Adhesives, Bonding, Semiconductor wafers, Fracture toughness, Wedges, Tensile strength
Journal Articles

Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading

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Takehiro Saitoh, Hidehito Matsuyama, Masayuki Toya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 420–425.
https://doi.org/10.1115/1.1602706
Published Online: September 17, 2003
View Articletitled, Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading
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Topics: Delamination, Fracture (Process), Resins, Temperature, Copper alloys, Fracture mechanics, Alloys, Radioactive tracers, Wedges, Cracking (Materials)
Journal Articles

Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration

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G. H. Lim, J. H. Ong, J. E. T. Penny
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1999, 121(2): 122–126.
https://doi.org/10.1115/1.2792666
Published Online: June 1, 1999
View Articletitled, Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration
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Topics: Printed circuit boards, Vibration, Wedges, Boundary-value problems, Dynamic response, Springs, Vibration tests
Journal Articles

Modeling the Vibration Restraints of Wedge Lock Card Guides

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D. B. Barker, Y. S. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 189–194.
https://doi.org/10.1115/1.2909316
Published Online: June 1, 1993
View Articletitled, Modeling the Vibration Restraints of Wedge Lock Card Guides
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Topics: Locks (Waterways), Modeling, Vibration, Wedges, Boundary-value problems, Deflection, Elastic constants, Frequency response, Rotation, Springs
Journal Articles

The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam

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Wan-Lee Yin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 208–213.
https://doi.org/10.1115/1.2909319
Published Online: June 1, 1993
View Articletitled, The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam
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Topics: Thermal stresses, Stress, Elasticity, Polynomials, Stress singularity, Variational techniques, Wedges
Journal Articles

Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits

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J. C. W. van Vroonhoven
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 28–33.
https://doi.org/10.1115/1.2909298
Published Online: March 1, 1993
View Articletitled, Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits
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Topics: Adhesion, Delamination, Integrated circuits, Stress singularity, Fracture (Materials), Failure, Fracture (Process), Silicon chips, Stress, Temperature
Journal Articles

Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Molding

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E. Suhir, L. T. Manzione
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 16–20.
https://doi.org/10.1115/1.2905359
Published Online: March 1, 1991
View Articletitled, Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Molding
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Topics: Stress, Transfer molding, Wire, Molding, Arches, Bonding, Design, Flow (Dynamics), Integrated circuits, Shapes