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Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai

J. Electron. Packag. September 2023, 145(3): 031009.

Paper No: EP-22-1039

DOI: https://doi.org/10.1115/1.4056991

Published Online: March 20, 2023

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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides

Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka

J. Electron. Packag. June 2022, 144(2): 021106.

Paper No: EP-21-1010

DOI: https://doi.org/10.1115/1.4052070

Published Online: October 6, 2021

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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping

Journal Articles

A Hybrid Antenna in Package Solution Using FOWLP Technology

Xuesong Zhang, Qian Wang, Bo Wang, Gang Wang, Xin Gu, Yu Chen, Lin Tan, Shengjuan Zhou, Jian Cai

J. Electron. Packag. September 2022, 144(3): 031005.

Paper No: EP-21-1024

DOI: https://doi.org/10.1115/1.4051379

Published Online: September 15, 2021

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Topics: Design, Manufacturing, Millimeter waves, Semiconductor wafers, Warping, Waveguides, Solders, Temperature, Molding

Journal Articles

Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging

Chang-Chun Lee, Kuo-Shu Kao, Hou-Chun Liu, Chia-Ping Hsieh, Tao-Chih Chang

J. Electron. Packag. March 2022, 144(1): 011001.

Paper No: EP-20-1071

DOI: https://doi.org/10.1115/1.4050198

Published Online: August 6, 2021

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Topics: Creep, Fatigue, Packaging, Reliability, Solder joints, Warping, Finite element analysis, Stress, Solders, Silicon

Journal Articles

Investigation of Strip Warpage Behavior in Wire Bonding Process

Wan-Chun Chuang, Wei-Long Chen

J. Electron. Packag. June 2020, 142(2): 021002.

Paper No: EP-19-1067

DOI: https://doi.org/10.1115/1.4045362

Published Online: February 3, 2020

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Topics: Strips, Temperature, Warping, Molding, Assembly lines

Journal Articles

Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Hsien-Chie Cheng, Yan-Cheng Liu

J. Electron. Packag. March 2020, 142(1): 011004.

Paper No: EP-19-1023

DOI: https://doi.org/10.1115/1.4044625

Published Online: September 19, 2019

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Topics: Semiconductor wafers, Shrinkage (Materials), Temperature, Warping, Molding, Manufacturing, Epoxy resins, Packaging, Epoxy adhesives

Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han

J. Electron. Packag. March 2020, 142(1): 011001.

Paper No: EP-19-1028

DOI: https://doi.org/10.1115/1.4043704

Published Online: August 1, 2019

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Topics: Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing

Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han

J. Electron. Packag. March 2020, 142(1): 011002.

Paper No: EP-19-1029

DOI: https://doi.org/10.1115/1.4044218

Published Online: August 1, 2019

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Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints

Journal Articles

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

John H. Lau

J. Electron. Packag. December 2019, 141(4): 040801.

Paper No: EP-18-1088

DOI: https://doi.org/10.1115/1.4043341

Published Online: May 17, 2019

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Topics: Packaging, Semiconductor wafers, Solders, Warping, Etching

Journal Articles

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee, Wei Xu

J. Electron. Packag. December 2018, 140(4): 041005.

Paper No: EP-17-1072

DOI: https://doi.org/10.1115/1.4041064

Published Online: September 10, 2018

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Topics: Ball-Grid-Array packaging, Electromagnetic scattering, Materials properties, Radiation scattering, Scattering (Physics), Temperature, Thermal expansion, Warping, Simulation, Laminates

Journal Articles

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler

J. Electron. Packag. March 2016, 138(1): 010906.

Paper No: EP-15-1094

DOI: https://doi.org/10.1115/1.4032493

Published Online: March 10, 2016

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Topics: Gaskets, Geometry, Heat, Manifolds, Reliability, Silicon, Stress, Topology, Vehicles, Warping

Journal Articles

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

R. I. Okereke, S. K. Sitaraman

J. Electron. Packag. September 2015, 137(3): 031006.

Paper No: EP-14-1030

DOI: https://doi.org/10.1115/1.4030065

Published Online: September 1, 2015

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Topics: Dimensions, Electrical resistance, Fatigue life, Manufacturing, Solders, Stress, Warping, Cycles, Signals, Thermomechanics

Journal Articles

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume

J. Electron. Packag. September 2014, 136(3): 031007.

Paper No: EP-13-1074

DOI: https://doi.org/10.1115/1.4027425

Published Online: May 12, 2014

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Topics: Diffraction gratings, Lasers, Resolution (Optics), Warping, Printed circuit boards, Accuracy and precision

Journal Articles

Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps

Chang-Chun Lee, Po Ting Lin

J. Electron. Packag. September 2014, 136(3): 031006.

Paper No: EP-13-1123

DOI: https://doi.org/10.1115/1.4026854

Published Online: May 5, 2014

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Topics: Bonding, Design, Packaging, Reliability, Warping, Compression, Finite element analysis

Journal Articles

Hygromechanical Analysis of Liquid Crystal Display Panels

Toru Ikeda, Tomonori Mizutani, Kiyoshi Miyake, Noriyuki Miyazaki

J. Electron. Packag. December 2013, 135(4): 041005.

Paper No: EP-10-1084

DOI: https://doi.org/10.1115/1.4025527

Published Online: November 5, 2013

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Topics: Diffusion (Physics), Liquid crystals, Polarizers (Light), Temperature, Thermomechanics, Warping, Gas laws (Thermodynamics), Materials properties

Journal Articles

Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules

Pushparajah Rajaguru, Stoyan Stoyanov, Hua Lu, Chris Bailey

J. Electron. Packag. June 2013, 135(2): 021009.

Paper No: EP-12-1043

DOI: https://doi.org/10.1115/1.4024056

Published Online: April 12, 2013

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Topics: Aluminum, Design, Optimization, Wire, Warping, Finite element analysis, Reliability, Failure

Journal Articles

Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties

Chih-Sung Chen

J. Electron. Packag. December 2011, 133(4): 041006.

DOI: https://doi.org/10.1115/1.4005293

Published Online: December 9, 2011

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Topics: Stress, Temperature, Warping, Thermomechanics

Journal Articles

Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models

Jamil A. Wakil, Patrick W. Dehaven, Nancy R. Klymko, Shaochen Chen

J. Electron. Packag. September 2011, 133(3): 031001.

DOI: https://doi.org/10.1115/1.4004656

Published Online: September 14, 2011

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Topics: Finite element model, Reliability, Silicon, Stress, Temperature, Thermomechanics, Transients (Dynamics), Warping, Laminates, Deformation

Journal Articles

Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet

Yu-Tang Yen, Te-Hua Fang, Yu-Cheng Lin

J. Electron. Packag. December 2010, 132(4): 041005.

DOI: https://doi.org/10.1115/1.4002723

Published Online: November 24, 2010

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Topics: Bonding, Taguchi methods, Warping, Design

Journal Articles

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Xi Liu, Jiantao Zheng, Suresh K. Sitaraman

J. Electron. Packag. June 2010, 132(2): 021004.

DOI: https://doi.org/10.1115/1.4001746

Published Online: June 11, 2010

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Topics: Finite element analysis, Manufacturing, Model validation, Reliability, Temperature, Warping, Laminates, Weight (Mass), Lasers, Thermomechanics

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Journal citation

NARROW

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A Hybrid Antenna in Package Solution Using FOWLP Technology

Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging

Investigation of Strip Warpage Behavior in Wire Bonding Process

Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps

Hygromechanical Analysis of Liquid Crystal Display Panels

Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules

Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties

Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models

Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

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