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Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov

J. Electron. Packag. September 2023, 145(3): 031007.

Paper No: EP-22-1070

DOI: https://doi.org/10.1115/1.4056886

Published Online: March 7, 2023

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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress

Journal Articles

Module-Level Thermal Interface Material Degradation in HALT

Joshua Tompkins, Alicia Medina Garcia, David Huitink, Haitao Liao

J. Electron. Packag. March 2023, 145(1): 011106.

Paper No: EP-22-1021

DOI: https://doi.org/10.1115/1.4056030

Published Online: November 23, 2022

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Topics: Cycles, Life testing, Stress, Temperature, Testing, Thermal resistance, Vibration, Electronics, Reliability, Heating

Includes: Supplementary data

Journal Articles

Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads

Pradeep Lall, Tony Thomas, Ken Blecker

J. Electron. Packag. June 2022, 144(2): 021111.

Paper No: EP-21-1067

DOI: https://doi.org/10.1115/1.4052630

Published Online: December 1, 2021

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Topics: Failure, Service life (Equipment), Signals, Temperature, Vibration, Principal component analysis

Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka

J. Electron. Packag. June 2022, 144(2): 021106.

Paper No: EP-21-1010

DOI: https://doi.org/10.1115/1.4052070

Published Online: October 6, 2021

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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping

Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu

J. Electron. Packag. March 2022, 144(1): 011005.

Paper No: EP-20-1097

DOI: https://doi.org/10.1115/1.4049813

Published Online: August 6, 2021

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Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering

Journal Articles

Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas

J. Electron. Packag. March 2021, 143(1): 011011.

Paper No: EP-20-1039

DOI: https://doi.org/10.1115/1.4047577

Published Online: July 23, 2020

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Topics: Signals, Vibration

Journal Articles

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark

J. Electron. Packag. September 2019, 141(3): 031010.

Paper No: EP-18-1096

DOI: https://doi.org/10.1115/1.4043479

Published Online: May 24, 2019

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Topics: Sensors, Circuits, Impact testing, Vibration, Polarization (Electricity), Polarization (Light), Polarization (Waves), Reflow soldering

Journal Articles

Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

Phil Geng

J. Electron. Packag. March 2019, 141(1): 010801.

Paper No: EP-18-1046

DOI: https://doi.org/10.1115/1.4042800

Published Online: February 25, 2019

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Topics: Design, Shock (Mechanics), Solder joints, Stress, Structural design, Vibration, Failure, Creep

Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm

J. Electron. Packag. December 2018, 140(4): 041004.

Paper No: EP-17-1062

DOI: https://doi.org/10.1115/1.4040923

Published Online: August 20, 2018

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Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders

Journal Articles

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott

J. Electron. Packag. June 2018, 140(2): 020905.

Paper No: EP-17-1083

DOI: https://doi.org/10.1115/1.4039301

Published Online: May 9, 2018

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Topics: Damage, Electronics, Engineering standards, Failure, Failure mechanisms, Reliability, Solder joints, Vibration, Transportation systems, Fatigue

Journal Articles

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Yasuo Takahashi, Hiroki Fukuda, Yasuhiro Yoneshima, Hideki Kitamura, Masakatsu Maeda

J. Electron. Packag. December 2017, 139(4): 041010.

Paper No: EP-17-1026

DOI: https://doi.org/10.1115/1.4038143

Published Online: October 25, 2017

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Topics: Bonding, Vibration, Flip-chip, Flip-chip devices

Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Jingshi Meng, Abhijit Dasgupta

J. Electron. Packag. September 2017, 139(3): 031001.

Paper No: EP-15-1102

DOI: https://doi.org/10.1115/1.4036187

Published Online: June 14, 2017

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Topics: Failure, Failure mechanisms, Microelectromechanical systems, Printed circuit boards, Stress, Resonance, Clearances (Engineering), Vibration, Finite element analysis, Electrical wires

Journal Articles

Analytical Solution for Electronic Assemblies Under Vibration

Mohammad A. Gharaibeh, Quang T. Su, James M. Pitarresi

J. Electron. Packag. March 2016, 138(1): 011003.

Paper No: EP-15-1113

DOI: https://doi.org/10.1115/1.4032497

Published Online: March 10, 2016

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Topics: Finite element analysis, Mode shapes, Solder joints, Solders, Stiffness, Stress, Vibration, Manufacturing, Deflection, Modal analysis

Journal Articles

Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations

Matthew Ernst, Ed Habtour, Abhijit Dasgupta, Michael Pohland, Mark Robeson, Mark Paulus

J. Electron. Packag. March 2015, 137(1): 011009.

Paper No: EP-14-1062

DOI: https://doi.org/10.1115/1.4028516

Published Online: October 15, 2014

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Topics: Durability, Excitation, Vibration, Inductors, Random vibration, Printed circuit boards, Electronic components, Failure

Journal Articles

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

D. N. Borza, I. T. Nistea

J. Electron. Packag. December 2012, 134(4): 041007.

DOI: https://doi.org/10.1115/1.4007812

Published Online: November 26, 2012

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Topics: Deformation, Failure, Printed circuit board assemblies, Screws, Stress, Vibration, Solder joints, Interferometry, Displacement, Boundary-value problems

Journal Articles

Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact

Pradeep Lall, Ryan Lowe, Kai Goebel

J. Electron. Packag. June 2012, 134(2): 021001.

DOI: https://doi.org/10.1115/1.4006706

Published Online: June 11, 2012

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Topics: Damage, Electronics, Failure, Shock (Mechanics), Solders, Spectroscopy, Vibration, Signals, Phase shift, Stress

Journal Articles

Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation

Y. Zhou, M. Al-Bassyiouni, A. Dasgupta

J. Electron. Packag. March 2009, 131(1): 011016.

DOI: https://doi.org/10.1115/1.3078195

Published Online: February 25, 2009

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Topics: Durability, Excitation, Fatigue, Printed circuit boards, Solders, Vibration, Finite element analysis, Failure

Journal Articles

Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package

Andy Perkins, Suresh K. Sitaraman

J. Electron. Packag. March 2008, 130(1): 011012.

DOI: https://doi.org/10.1115/1.2837520

Published Online: February 14, 2008

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Topics: Ceramics, Failure, Fatigue life, Solder joints, Solders, Vibration, Stress, Cycles, Vehicles, Finite element model

Journal Articles

Boiling Heat Transfer Enhancement Using a Submerged, Vibration-Induced Jet

Steven W. Tillery, Samuel N. Heffington, Marc K. Smith, Ari Glezer

J. Electron. Packag. June 2006, 128(2): 145–149.

DOI: https://doi.org/10.1115/1.2188954

Published Online: February 1, 2006

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Topics: Boiling, Bubbles, Heat transfer, Temperature, Vibration, Vapors, Water, Diaphragms (Mechanical devices), Diaphragms (Structural), Heat flux

Journal Articles

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht, Robin Ferebee

J. Electron. Packag. December 2006, 128(4): 339–345.

DOI: https://doi.org/10.1115/1.2351897

Published Online: January 8, 2006

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Topics: Aluminum, Damage, Life testing, Shock (Mechanics), Stress, Vibration, Testing, Printed circuit boards, Cycles, Failure

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Journal citation

NARROW

Supplemental Material

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Module-Level Thermal Interface Material Degradation in HALT

Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Analytical Solution for Electronic Assemblies Under Vibration

Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact

Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation

Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package

Boiling Heat Transfer Enhancement Using a Submerged, Vibration-Induced Jet

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

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