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Journal Articles

Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric

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Victor A. Martinez, Carol Caceres, Alfonso Ortega
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041118.
Paper No: EP-24-1040
https://doi.org/10.1115/1.4066101
Published Online: August 24, 2024
View Articletitled, Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric
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Topics: Temperature, Thermal resistance, Thermocouples, Coolants, Errors, Flow (Dynamics), Heat exchangers, Uncertainty
Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

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Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
View Articletitled, A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging
Journal Articles

Coupled Calculations of Data Center Cooling and Power Distribution Systems

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Aaron P. Wemhoff, Faisal Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041002.
Paper No: EP-21-1044
https://doi.org/10.1115/1.4052101
Published Online: October 6, 2021
View Articletitled, Coupled Calculations of Data Center Cooling and Power Distribution Systems
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Topics: Cooling, Cooling systems, Data centers, Power systems (Machinery), Stress, Energy efficiency, Electronic systems, Uncertainty
Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

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Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011003.
Paper No: EP-20-1083
https://doi.org/10.1115/1.4050696
Published Online: August 6, 2021
View Articletitled, Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

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Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031117.
Paper No: EP-20-1030
https://doi.org/10.1115/1.4047846
Published Online: August 17, 2020
View Articletitled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa in another window
Topics: Flow (Dynamics), Fluids, Heat, Heat flux, Manifolds, Microchannels, Pressure drop, Temperature, Uncertainty, Cooling
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

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Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011001.
Paper No: EP-19-1028
https://doi.org/10.1115/1.4043704
Published Online: August 1, 2019
View Articletitled, Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development
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Topics: Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

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Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011002.
Paper No: EP-19-1029
https://doi.org/10.1115/1.4044218
Published Online: August 1, 2019
View Articletitled, Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model
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Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints
Journal Articles

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

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Aditya Chandramohan, Sara K. Lyons, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041008.
Paper No: EP-18-1028
https://doi.org/10.1115/1.4041360
Published Online: October 1, 2018
View Articletitled, Error Reduction in Infrared Thermography by Multiframe Super-Resolution
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Topics: Emissivity, Errors, Resolution (Optics), Temperature, Thermography, Uncertainty
Journal Articles

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

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Hamoon Azizsoltani, Achintya Haldar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
https://doi.org/10.1115/1.4040924
Published Online: August 20, 2018
View Articletitled, Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept
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Topics: Failure, Finite element analysis, Modeling, Reliability, Solders, Thermomechanics, Lead-free solders, Electronic packaging, Uncertainty, Stress
Journal Articles

Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling

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Pablo A. de Oliveira, Jader R. Barbosa, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031005.
Paper No: EP-17-1008
https://doi.org/10.1115/1.4036817
Published Online: June 28, 2017
View Articletitled, Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling
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Topics: Compressors, Cooling, Heat, Heat sinks, Heat transfer, Refrigeration, Stress, Temperature, Flow (Dynamics), Refrigerants
Journal Articles

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

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Ronald J. Warzoha, Andrew N. Smith, Maurice Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
https://doi.org/10.1115/1.4035178
Published Online: December 29, 2016
View Articletitled, Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument
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Topics: Heat, Instrumentation, Probes, Resolution (Optics), Steady state, Uncertainty, Heat flux, Measurement uncertainty, Fillers (Materials), Temperature measurement
Journal Articles

Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers

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Vikneshan Sundaralingam, Vaibhav K. Arghode, Yogendra Joshi, Wally Phelps
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011007.
Paper No: EP-13-1052
https://doi.org/10.1115/1.4028520
Published Online: October 7, 2014
View Articletitled, Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers
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Topics: Air flow, Containment, Data centers, Flow (Dynamics), Stress, Temperature, Tiles, Uncertainty, Heat
Journal Articles

A Stepped-Bar Apparatus for Thermal Resistance Measurements

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Dakotah R. Thompson, Sameer R. Rao, Baratunde A. Cola
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041002.
Paper No: EP-13-1019
https://doi.org/10.1115/1.4025116
Published Online: August 13, 2013
View Articletitled, A Stepped-Bar Apparatus for Thermal Resistance Measurements
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Topics: Heat, Measurement uncertainty, Temperature, Thermal resistance, Thermocouples, Uncertainty, Thermal conductivity, Errors, Design, ASTM International
Journal Articles

Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell

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Ethan Cruz, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030904.
Paper No: EP-12-1092
https://doi.org/10.1115/1.4024944
Published Online: July 24, 2013
View Articletitled, Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell
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Topics: Computer simulation, Data centers, Flow (Dynamics), Temperature, Tiles, Turbulence, Computational fluid dynamics, Uncertainty
Journal Articles

Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

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S. Radhakrishnan, G. Subbarayan, L. Nguyen, W. Mazotti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 229–235.
https://doi.org/10.1115/1.2753885
Published Online: October 22, 2006
View Articletitled, Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages
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Topics: Epoxy adhesives, Epoxy resins, Uncertainty, Viscoelasticity, Temperature, Modeling, Lasers, Displacement
Journal Articles

Experimental Measurements of the Flow and Heat Transfer of a Square Jet Impinging on an Array of Square Pin Fins

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Johnny S. Issa, Alfonso Ortega
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 61–70.
https://doi.org/10.1115/1.2160513
Published Online: June 14, 2005
View Articletitled, Experimental Measurements of the Flow and Heat Transfer of a Square Jet Impinging on an Array of Square Pin Fins
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Pressure, Clearances (Engineering), Uncertainty
Journal Articles

A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System

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Satish Radhakrishnan, Ganesh Subbarayan, Luu Nguyen, William P. Mazotti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 391–396.
https://doi.org/10.1115/1.2056573
Published Online: December 14, 2004
View Articletitled, A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System
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Topics: Algorithms, Laser beams, Optical fiber, Simulated annealing, Uncertainty, Temperature, Lasers
Journal Articles

Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages

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T. Winkler, A. Schubert, E. Kaulfersch, B. Michel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 282–285.
https://doi.org/10.1115/1.2793853
Published Online: December 1, 1999
View Articletitled, Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages
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Topics: Electromagnetic scattering, Thermomechanics, Finite element analysis, Uncertainty, Simulation, Chaos, Electronic packages, Materials properties, Modeling, Optimization
Journal Articles

A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations

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H. A. Jensen, A. O. Cifuentes
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1998, 120(4): 391–394.
https://doi.org/10.1115/1.2792652
Published Online: December 1, 1998
View Articletitled, A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations
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Topics: Electronic systems, Excitation, Sensitivity analysis, Design, Dynamic response, Electronic components, Uncertainty
Journal Articles

Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling

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Shigekazu Kieda, Noriyuki Ashiwake, Takahiro Daikoku, Shizuo Zushi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 270–275.
https://doi.org/10.1115/1.2909328
Published Online: September 1, 1993
View Articletitled, Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling
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Topics: Computer cooling, Finite element methods, Thermal analysis, Computers, Cooling, Heat, Sensitivity analysis, Temperature, Temperature distribution, Thermal properties