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Journal Articles

Special Issue on InterPACK2022

Free
Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Articletitled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

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James Spencer Lundh, Yiwen Song, Bikramjit Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Brianna A. Klein, Dustin Kendig, Hyungtak Kim, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031113.
Paper No: EP-20-1012
https://doi.org/10.1115/1.4047100
Published Online: May 21, 2020
View Articletitled, Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
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Topics: Dynamics (Mechanics), Electronics, Energy gap, Gallium nitride, Heating, Imaging, Steady state, Temperature, Temperature measurement, Thermal characterization
Journal Articles

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

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A. Bar-Cohen, J. J. Maurer, D. H. Altman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040803.
Paper No: EP-18-1067
https://doi.org/10.1115/1.4043404
Published Online: July 30, 2019
View Articletitled, Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Transistors, Thermal conductivity, Temperature, Junctions, Heat, Thermal management
Journal Articles

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Open Access
Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Ľuboš Černaj, Daniel Donoval, Jaroslav Kováč, Christian Dua, Sylvain L. Delage, Jean-Claude Jacquet
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031007.
Paper No: EP-18-1093
https://doi.org/10.1115/1.4043477
Published Online: May 17, 2019
View Articletitled, Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation
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Topics: Gallium nitride, Heat, Simulation, Temperature, Transistors, Temperature distribution, Temperature measurement, Thermal properties, Gates (Closures), Thermal analysis
Journal Articles

Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction

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Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, Henrik Hovsepyan, Mark Nakamoto, Wei Zhao, Riko Radojcic, Uwe Muehle, Ehrenfried Zschech
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020906.
Paper No: EP-16-1138
https://doi.org/10.1115/1.4036402
Published Online: June 12, 2017
View Articletitled, Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction
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Topics: Simulation, Stress, Transistors, Flow (Dynamics), Design, Silicon
Journal Articles

Thermal Modeling Technique for Multiple Transistors Within Silicon Chip

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Tohru Suwa, Hamid Hadim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
https://doi.org/10.1115/1.4005291
Published Online: December 23, 2011
View Articletitled, Thermal Modeling Technique for Multiple Transistors Within Silicon Chip
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Topics: Finite element analysis, Heat, Modeling, Silicon chips, Temperature, Temperature distribution, Transistors
Journal Articles

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

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Xiaoling Yu, Lianghua Zhang, Enming Zhou, Quanke Feng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011008.
https://doi.org/10.1115/1.4003214
Published Online: March 10, 2011
View Articletitled, Heat Transfer of an IGBT Module Integrated With a Vapor Chamber
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Topics: Circuits, Copper, Heat, Heat transfer, Junctions, Stress, Temperature, Thermal conductivity, Thermal resistance, Transients (Dynamics)
Journal Articles

Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs

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Hsien-Cheng Tseng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
https://doi.org/10.1115/1.4003515
Published Online: March 9, 2011
View Articletitled, Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs
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Topics: Design, Gallium arsenide, Genetic algorithms, Optimization, Packaging, Thermal resistance, Transistors, Thermal stability, Thermal management
Journal Articles

Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

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Takashi Anzawa, Qiang Yu, Masanori Yamagiwa, Tadahiro Shibutani, Masaki Shiratori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031012.
https://doi.org/10.1115/1.4002451
Published Online: September 30, 2010
View Articletitled, Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis
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Topics: Bonding, Crack propagation, Fatigue life, Fracture (Materials), Reliability, Solder joints, Temperature, Temperature distribution, Wire, Wire bonding
Journal Articles

Novel Design of Thermal-Via Configurations for Collector-Up HBTs

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Pei-Hsuan Lee, Hsien-Cheng Tseng, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044501.
https://doi.org/10.1115/1.4000282
Published Online: October 21, 2009
View Articletitled, Novel Design of Thermal-Via Configurations for Collector-Up HBTs
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Topics: Design, Finite element model, Gallium arsenide, Temperature, Temperature distribution, Transistors, Finite element analysis, Packaging, Heat
Journal Articles

Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin

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G. De Mey, M. Wójcik, J. Pilarski, M. Lasota, J. Banaszczyk, B. Vermeersch, A. Napieralski, M. De Paepe
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2009, 131(1): 014501.
https://doi.org/10.1115/1.3068307
Published Online: February 12, 2009
View Articletitled, Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin
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Topics: Cooling, Natural convection, Thermal resistance, Transistors, Junctions
Journal Articles

Cross-Verification of Thermal Characterization of a Microcooler

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Zs. Kohári, Gy. Bognár, Gy. Horváth, A. Poppe, M. Rencz, V. Székely
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 167–171.
https://doi.org/10.1115/1.2721089
Published Online: February 15, 2007
View Articletitled, Cross-Verification of Thermal Characterization of a Microcooler
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Topics: Cooling, Flow (Dynamics), Heat flux, Microchannels, Microcoolers, Sensors, Thermal resistance, Transients (Dynamics), Heat, Transistors
Journal Articles

Thermal Phenomena in Nanoscale Transistors

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Eric Pop, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 102–108.
https://doi.org/10.1115/1.2188950
Published Online: December 14, 2006
View Articletitled, Thermal Phenomena in Nanoscale Transistors
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Topics: Phonons, Silicon, Transistors, Heat, Nanoscale phenomena, Electrons, Nanowires
Journal Articles

Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding

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J. Puigcorbe´, S. Marco, S. Leseduarte, M. Carmona, O. Vendier, C. Devron, S. L. Delage, D. Floriot, H. Blanck
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 549–555.
https://doi.org/10.1115/1.1604157
Published Online: December 15, 2003
View Articletitled, Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding
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Topics: Bonding, Creep, Finite element analysis, Flip-chip devices, Modeling, Optimization, Stress, Temperature, Transistors, Gallium arsenide
Journal Articles

Industrial Electonics: Devices and Systems, Second Edition

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Dale R. Patrick, Stephen W. Fardo, Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2001, 123(3): 319.
https://doi.org/10.1115/1.1387243
Published Online: September 1, 2001
View Articletitled, Industrial Electonics: Devices and Systems, Second Edition
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Topics: Engineers, Transistors, Computers, Junctions, Electronics, Electronics engineers, Energy resources, Gates (Closures), Generators, Mechanical engineering
Journal Articles

Thermal Math Modeling and Analysis of an Electronic Assembly

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K. N. Shukla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 372–378.
https://doi.org/10.1115/1.1388561
Published Online: May 5, 2000
View Articletitled, Thermal Math Modeling and Analysis of an Electronic Assembly
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Topics: Finite element methods, Heat, Heat transfer coefficients, Manufacturing, Mathematics, Modeling, Temperature, Temperature distribution, Thermal analysis, Printed circuit boards
Journal Articles

Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading

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Yi-Hsin Pao, Ellen Eisele
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 164–172.
https://doi.org/10.1115/1.2905382
Published Online: June 1, 1991
View Articletitled, Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading
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Topics: Shear (Mechanics), Stress, Solder joints, Deflection, Differential equations, Dimensions, Materials properties, Shear stress, Temperature, Temperature controls
Journal Articles

Deformation in Multilayer Stacked Assemblies

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Tsung-Yu Pan, Yi-Hsin Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 30–34.
https://doi.org/10.1115/1.2904337
Published Online: March 1, 1990
View Articletitled, Deformation in Multilayer Stacked Assemblies
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Topics: Deformation, Finite element analysis, Geometry, Manufacturing, Polynomials, Silicon, Solders, Stress, Temperature controls, Transistors
Journal Articles

Thermal Stress CAD Analysis of a Multi-Layer Composite of an Operating Transistor Package

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Agha J. Ghorieshi, Umid R. Nejib
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1990, 112(1): 77–80.
https://doi.org/10.1115/1.2904345
Published Online: March 1, 1990
View Articletitled, Thermal Stress CAD Analysis of a Multi-Layer Composite of an Operating Transistor Package
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Topics: Composite materials, Computer-aided design, Thermal stresses, Transistors, Shear stress, Cooling systems, Corners (Structural elements), Cycles, Design, Electronic packages