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Journal Articles

Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?

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Mohammad A. Gharaibeh, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021001.
Paper No: EP-24-1080
https://doi.org/10.1115/1.4067137
Published Online: December 9, 2024
View Articletitled, Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
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Topics: Deformation, Density, Finite element analysis, Solders, Stress, Thermomechanics, Creep, Simulation, Alloys, Hardening
Journal Articles

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

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Pratik Bansode, Rohit Suthar, Rabin Bhandari, Akshay Lakshminarayana, Naga Tejesh Eda, Gautam Gupta, Vibin Simon, Himanshu Modi, Vivek Nair, Pardeep Shahi, Satyam Saini, Krishna Bhavana Sivaraju, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041112.
Paper No: EP-24-1042
https://doi.org/10.1115/1.4066044
Published Online: August 9, 2024
View Articletitled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
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Topics: Cooling, Elastic moduli, Fluids, Temperature, Thermomechanics, Heat, Energy dissipation, Glass transition, Data centers, Reliability
Journal Articles

Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications

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Giuseppe Mauromicale, Michele Calabretta, Giuseppe Scarcella, Giacomo Scelba, Alessandro Sitta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031003.
Paper No: EP-22-1049
https://doi.org/10.1115/1.4056413
Published Online: December 23, 2022
View Articletitled, Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications
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Topics: Power semiconductor devices, Simulation, Design, Automotive industry, System-in-package, Thermomechanics, Cycles
Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

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Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
https://doi.org/10.1115/1.4056445
Published Online: December 23, 2022
View Articletitled, Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles
Journal Articles

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

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Shiva Farzinazar, Zongqing Ren, Jungyun Lim, Jae Choon Kim, Jaeho Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021118.
Paper No: EP-21-1038
https://doi.org/10.1115/1.4053948
Published Online: March 28, 2022
View Articletitled, Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging
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Topics: Heat, Optimization, Thermomechanics, Topology, Design, Electronic packaging, Heat sinks
Journal Articles

A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime

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Louis Schuler, Ludovic Chamoin, Zoubir Khatir, Mounira Berkani, Merouane Ouhab, Nicolas Degrenne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031013.
Paper No: EP-21-1138
https://doi.org/10.1115/1.4053767
Published Online: March 7, 2022
View Articletitled, A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
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Topics: Design, Solder joints, Temperature, Thermomechanics, Geometry, Finite element analysis, Convection, Cycles, Sensitivity analysis
Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

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A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021106.
Paper No: EP-21-1010
https://doi.org/10.1115/1.4052070
Published Online: October 6, 2021
View Articletitled, Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping
Journal Articles

Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

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Hayden Carlton, Dustin Pense, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031112.
Paper No: EP-19-1122
https://doi.org/10.1115/1.4047099
Published Online: May 21, 2020
View Articletitled, Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
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Topics: Temperature, Testing, Thermal resistance, Thermomechanics, Failure, Pumps, Steady state
Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

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Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011011.
Paper No: EP-19-1064
https://doi.org/10.1115/1.4045157
Published Online: November 8, 2019
View Articletitled, Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
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Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability
Journal Articles

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

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Alexander Otto, Sven Rzepka, Bernhard Wunderle
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031012.
Paper No: EP-18-1098
https://doi.org/10.1115/1.4043646
Published Online: June 17, 2019
View Articletitled, Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices
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Topics: Cycles, Failure, Junctions, Temperature, Wire, Stress, Failure mechanisms, Thermomechanics
Journal Articles

Mechanical Characterization of Thermal Interface Materials and Its Challenges

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Vijay Subramanian, Jorge Sanchez, Joseph Bautista, Yi He, Jinlin Wang, Abhishek Das, Jesus Gerardo Reyes Schuldes, Kyle Yazzie, Hemanth K. Dhavaleswarapu, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010804.
Paper No: EP-18-1086
https://doi.org/10.1115/1.4042805
Published Online: March 13, 2019
View Articletitled, Mechanical Characterization of Thermal Interface Materials and Its Challenges
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Topics: Adhesion, Compression, Shear (Mechanics), Temperature, Thermal expansion, Stress, Thermomechanics, Silicon
Journal Articles

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

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Aastha Uppal, Jerrod Peterson, Je-Young Chang, Xi Guo, Frank Liang, Weihua Tang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010803.
Paper No: EP-18-1053
https://doi.org/10.1115/1.4042801
Published Online: March 4, 2019
View Articletitled, Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms
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Topics: Design, Modeling, Thermomechanics, Stress, Heat pipes, Pressure
Journal Articles

Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements

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J.-B. Libot, J. Alexis, O. Dalverny, L. Arnaud, P. Milesi, F. Dulondel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021002.
Paper No: EP-17-1123
https://doi.org/10.1115/1.4042806
Published Online: March 1, 2019
View Articletitled, Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements
Open the PDF for Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements in another window
Topics: Manufacturing, Shear stress, Solder joints, Solders, Strain gages, Temperature, Thermomechanics, Cycles, Construction, Shear (Mechanics)
Journal Articles

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

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Hamoon Azizsoltani, Achintya Haldar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
https://doi.org/10.1115/1.4040924
Published Online: August 20, 2018
View Articletitled, Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept
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Topics: Failure, Finite element analysis, Modeling, Reliability, Solders, Thermomechanics, Lead-free solders, Electronic packaging, Uncertainty, Stress
Journal Articles

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

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Lei Shi, Lin Chen, David Wei Zhang, Evan Liu, Qiang Liu, Ching-I Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011002.
Paper No: EP-17-1035
https://doi.org/10.1115/1.4038245
Published Online: March 2, 2018
View Articletitled, Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging
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Topics: Density, Design, Finite element model, Packaging, Reliability, Semiconductor wafers, Solder joints, Solders, Stress, Fatigue life
Journal Articles

Effect of Design Parameters on Thermomechanical Stress in Silicon of Through-Silicon Via

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Joo-Sun Hwang, Seung-Ho Seo, Won-Jun Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031006.
Paper No: EP-15-1054
https://doi.org/10.1115/1.4033923
Published Online: June 28, 2016
View Articletitled, Effect of Design Parameters on Thermomechanical Stress in Silicon of Through-Silicon Via
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Topics: Copper, Design, Silicon, Stress, Thermomechanics, Stress concentration, Annealing, Yield stress
Journal Articles

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

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Soud Farhan Choudhury, Leila Ladani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041003.
Paper No: EP-14-1099
https://doi.org/10.1115/1.4031523
Published Online: September 25, 2015
View Articletitled, Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study
Open the PDF for Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study in another window
Topics: Cycles, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Geometry, Reliability, Integrated circuits, Intermetallic compounds
Journal Articles

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

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R. I. Okereke, S. K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031006.
Paper No: EP-14-1030
https://doi.org/10.1115/1.4030065
Published Online: September 1, 2015
View Articletitled, Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics
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Topics: Dimensions, Electrical resistance, Fatigue life, Manufacturing, Solders, Stress, Warping, Cycles, Signals, Thermomechanics
Journal Articles

Hygromechanical Analysis of Liquid Crystal Display Panels

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Toru Ikeda, Tomonori Mizutani, Kiyoshi Miyake, Noriyuki Miyazaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041005.
Paper No: EP-10-1084
https://doi.org/10.1115/1.4025527
Published Online: November 5, 2013
View Articletitled, Hygromechanical Analysis of Liquid Crystal Display Panels
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Topics: Diffusion (Physics), Liquid crystals, Polarizers (Light), Temperature, Thermomechanics, Warping, Gas laws (Thermodynamics), Materials properties
Journal Articles

Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects

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Raphael Okereke, Karan Kacker, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031004.
Paper No: EP-12-1102
https://doi.org/10.1115/1.4024112
Published Online: June 4, 2013
View Articletitled, Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects
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Topics: Manufacturing, Reliability, Stress, Thermomechanics, Displacement, Semiconductor wafers, Copper, Simulation, Solders