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Journal Articles

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

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Liwen Zhang, Chen Yang, He Yang, Jinchan Wang, Jincan Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031003.
Paper No: EP-23-1065
https://doi.org/10.1115/1.4064522
Published Online: February 7, 2024
View Articletitled, Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network
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Topics: Algorithms, Artificial neural networks, Errors, Fracture (Materials), Neural network models, Optimization algorithms, Reliability, Silicon, Finite element methods, Modeling
Journal Articles

Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging

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Meng-Kai Shih, Guan-Sian Lin, Jonny Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031002.
Paper No: EP-23-1072
https://doi.org/10.1115/1.4064355
Published Online: January 12, 2024
View Articletitled, Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging
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Topics: Delamination, Diffusion (Physics), Fracture (Materials), Manufacturing, Stress, Temperature, Design, Adhesion, Thermal stresses, Modeling
Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

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Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
https://doi.org/10.1115/1.4052246
Published Online: November 22, 2021
View Articletitled, Design and Fabrication of Leadless Package Structure for Pressure Sensors
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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature
Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

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Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011003.
Paper No: EP-19-1014
https://doi.org/10.1115/1.4044476
Published Online: September 19, 2019
View Articletitled, Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems
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Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature
Journal Articles

Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack

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R. W. Johnson, Y.-L. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021011.
Paper No: EP-14-1045
https://doi.org/10.1115/1.4029345
Published Online: June 1, 2015
View Articletitled, Analysis of Thermal Stress and Its Influence on Carrier Mobility in Three-Dimensional Microelectronic Chip Stack
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Topics: Electron mobility, Solders, Stress, Thermal stresses, Intermetallic compounds, Deformation
Journal Articles

Thermal Cycling Study of Quilt Packaging

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M. Ashraf Khan, Quanling Zheng, David Kopp, Wayne Buckhanan, Jason M. Kulick, Patrick Fay, Alfred M. Kriman, Gary H. Bernstein
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021008.
Paper No: EP-14-1057
https://doi.org/10.1115/1.4029245
Published Online: June 1, 2015
View Articletitled, Thermal Cycling Study of Quilt Packaging
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Topics: Cycles, Packaging, Quadratic programming, Solders, Testing, Stress, Copper, Failure, Reliability, Tin
Journal Articles

Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

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Yi Yan, Youliang Guan, Xu Chen, Guo-Quan Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041003.
Paper No: EP-13-1030
https://doi.org/10.1115/1.4025247
Published Online: September 4, 2013
View Articletitled, Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode
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Topics: High power lasers, Lasers, Silver, Thermal stresses, Finite element analysis, Temperature, Wavelength, Currents, Simulation, Manufacturing
Journal Articles

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

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A. F. M. Arif, Syed M. Zubair, S. Pashah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041005.
https://doi.org/10.1115/1.4007258
Published Online: October 30, 2012
View Articletitled, Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications
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Topics: Composite materials, Computer cooling, Flow (Dynamics), Geometry, Heat, Heat sinks, Stress, Temperature, Thermal analysis, Epoxy adhesives
Journal Articles

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

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Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020903.
https://doi.org/10.1115/1.4006515
Published Online: June 11, 2012
View Articletitled, Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package
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Topics: Finite element methods, Silicon, Silicon chips, Simulation, Stress, System-in-package, Thermal stresses, Temperature, Stress concentration
Journal Articles

The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions

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N. H. Chao, J. A. Cordes, D. Carlucci, M. E. DeAngelis, Jyeching Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041003.
https://doi.org/10.1115/1.4005375
Published Online: December 8, 2011
View Articletitled, The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions
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Topics: Munitions, Simulation, Temperature, Thermal stresses, Transients (Dynamics), Electronic packaging, Microelectromechanical systems
Journal Articles

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

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Michael R. Maughan, Robert R. Stephens, Donald M. Blackketter, Karl K. Rink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011009.
https://doi.org/10.1115/1.3068318
Published Online: February 13, 2009
View Articletitled, Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators
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Topics: Finite element analysis, Glass, Press fits, Shear stress, Stress, Thermal stresses, Welding, Wire, Bridges (Structures), Laser welding
Journal Articles

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

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M. A. Neidigk, Y.-L. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
https://doi.org/10.1115/1.3068298
Published Online: February 11, 2009
View Articletitled, Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer
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Topics: Ceramics, Coating processes, Coatings, Computer simulation, Cooling, Epoxy resins, Failure, Ferrites (Magnetic materials), Finite element analysis, Manufacturing
Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

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Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021008.
https://doi.org/10.1115/1.2912188
Published Online: May 9, 2008
View Articletitled, On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion
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Topics: Damage, Failure, Failure mechanisms, Flip-chip devices, High cycle fatigue, Power density, Solders, Stress, Thermal expansion, Wave motion
Journal Articles

Improved Method of C O 2 Laser Cutting of Aluminum Nitride

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Raathai Molian, Pranav Shrotriya, Pal Molian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024501.
https://doi.org/10.1115/1.2912223
Published Online: May 8, 2008
View Articletitled, Improved Method of C O 2 Laser Cutting of Aluminum Nitride
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Topics: Aluminum, Cutting, Fracture (Materials), Laser cutting, Lasers, Thermal stresses, Fracture (Process), Oxygen, Stress
Journal Articles

Interfacial Thermal Stresses in Trilayer Assemblies

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H. R. Ghorbani, J. K. Spelt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 314–323.
https://doi.org/10.1115/1.1938205
Published Online: November 24, 2004
View Articletitled, Interfacial Thermal Stresses in Trilayer Assemblies
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Topics: Shear (Mechanics), Shear stress, Stress, Manufacturing, Plane strain, Thermal stresses, Finite element analysis
Journal Articles

Multi-Physics Simulation of a Microprocessor Package Under Water Cooling

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Liu Bao-Min, Mui Y. C.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 384–389.
https://doi.org/10.1115/1.1774197
Published Online: October 6, 2004
View Articletitled, Multi-Physics Simulation of a Microprocessor Package Under Water Cooling
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Topics: Cooling, Flow (Dynamics), Simulation, Thermal stresses, Water, Thermal resistance, Temperature, Physics
Journal Articles

The Thermoelastic Analysis of Chip-Substrate System

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Linzhi Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 325–332.
https://doi.org/10.1115/1.1772413
Published Online: October 6, 2004
View Articletitled, The Thermoelastic Analysis of Chip-Substrate System
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Topics: Fourier series, Heat conduction, Integrated circuits, Stress, Temperature, Thermal stresses, Thermoelasticity, Stress concentration, Reliability, Heat
Journal Articles

A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly

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M. Y. Tsai, C. H. Hsu, C. N. Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 115–119.
https://doi.org/10.1115/1.1648056
Published Online: April 30, 2004
View Articletitled, A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly
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Topics: Manufacturing, Stress, Thermal stresses, Warping, Finite element analysis, Shear (Mechanics), Deformation
Journal Articles

Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method

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T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 142–147.
https://doi.org/10.1115/1.1649245
Published Online: April 30, 2004
View Articletitled, Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method
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Topics: Fracture (Materials), Laser beams, Lasers, Microcracks, Semiconductor wafers, Thermal shock, Thermal stresses, Temperature
Journal Articles

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

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John H. Lau, Fellow ASME, Steve Erasmus, Yida Zou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 602–608.
https://doi.org/10.1115/1.1604807
Published Online: December 15, 2003
View Articletitled, Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device
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Topics: Deflection, Glass, Stress, Boundary-value problems, Pressure, Temperature, Double refraction, Thermal stresses