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Journal Articles

Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics

Available to Purchase
Chong Ye, Charles I. Ume, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021007.
Paper No: EP-19-1085
https://doi.org/10.1115/1.4046163
Published Online: March 9, 2020
View Articletitled, Mechanical Characterization of Embedded Serpentine Conductors in Wearable Electronics
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Topics: Carbon, Electronics, Finite element analysis, Polymers, Strips, Simulation, Textiles, Mechanical properties
Journal Articles

Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

Available to Purchase
N. R. Sottos, J. M. Ockers, M. Swindeman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 37–43.
https://doi.org/10.1115/1.2792659
Published Online: March 1, 1999
View Articletitled, Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications
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Topics: Composite materials, Printed circuit boards, Thermoelasticity, Textiles, Geometry, Lumber, Elastic moduli, Epoxy adhesives, Epoxy resins, Fibers
Journal Articles

Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design

Available to Purchase
R. K. Agarwal, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 219–224.
https://doi.org/10.1115/1.2909321
Published Online: June 1, 1993
View Articletitled, Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design
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Topics: Composite materials, Design, Electrical properties, Printed circuit boards, Textiles, Boundary-value problems, Epoxy adhesives, Epoxy resins, Finite element methods, Glass
Journal Articles

Strains in Aluminum-Adhesive-Ceramic Trilayers

Available to Purchase
P. M. Hall, F. L. Howland, Y. S. Kim, L. H. Herring
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 288–302.
https://doi.org/10.1115/1.2904381
Published Online: December 1, 1990
View Articletitled, Strains in Aluminum-Adhesive-Ceramic Trilayers
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Topics: Adhesives, Aluminum, Ceramics, Epoxy adhesives, Epoxy resins, Elastic moduli, Temperature, Dimensions, Elastomers, Heat