1-20 of 24
Temperature gradient
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density

Available to Purchase
Haibin Zhang, Quan Sun, Zhidan Sun, Yebo Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021006.
Paper No: EP-22-1017
https://doi.org/10.1115/1.4055469
Published Online: September 28, 2022
View Articletitled, Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density
Open the PDF for Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density in another window
Topics: Current density, Silver, Wire, Temperature gradient, Electrodiffusion
Journal Articles

Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model

Available to Purchase
Wing K. Yeung, Tung T. Lam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031011.
Paper No: EP-21-1028
https://doi.org/10.1115/1.4052948
Published Online: December 27, 2021
View Articletitled, Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model
Open the PDF for Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model in another window
Topics: Heat flux, Relaxation (Physics), Temperature, Elemental semiconductors, Temperature gradient, Heat
Journal Articles

Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation

Available to Purchase
Noris Gallandat, Danielle Hesse, J. Rhett Mayor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010908.
Paper No: EP-15-1096
https://doi.org/10.1115/1.4032347
Published Online: March 10, 2016
View Articletitled, Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation
Open the PDF for Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation in another window
Topics: Convection, Density, Flow (Dynamics), Heat, Heat exchangers, Heat transfer, Hydrofoil, Pressure drop, Temperature, Water
Journal Articles

Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture

Available to Purchase
Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021008.
https://doi.org/10.1115/1.4001852
Published Online: June 25, 2010
View Articletitled, Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
Open the PDF for Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture in another window
Topics: Junctions, Temperature, Pareto optimization, Delays, Temperature gradient, Engines
Journal Articles

Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Available to Purchase
Mohd F. Abdulhamid, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
https://doi.org/10.1115/1.3068296
Published Online: February 11, 2009
View Articletitled, Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties
Open the PDF for Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties in another window
Topics: Annealing, Lead-free solders, Mechanical properties, Solder joints, Solders, Temperature gradient, Tin, Testing, Elastic moduli, Nanoindentation
Journal Articles

Compact Thermal Models: A Global Approach

Available to Purchase
Mohamed-Nabil Sabry, Hossam Saleh Abdelmeguid
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041107.
https://doi.org/10.1115/1.2993132
Published Online: November 14, 2008
View Articletitled, Compact Thermal Models: A Global Approach
Open the PDF for Compact Thermal Models: A Global Approach in another window
Topics: Boundary-value problems, Cooling, Heat, Reliability, Temperature, Thermal analysis, Heat flux, Modeling, Resistors, Heat transfer
Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

Available to Purchase
Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
https://doi.org/10.1115/1.2753908
Published Online: April 16, 2007
View Articletitled, Flexible Profile Compact Thermal Models for Practical Geometries
Open the PDF for Flexible Profile Compact Thermal Models for Practical Geometries in another window
Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability
Journal Articles

Highlights from the European Thermal Project PROFIT

Available to Purchase
Clemens J. M. Lasance
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2004, 126(4): 565–570.
https://doi.org/10.1115/1.1827258
Published Online: January 24, 2005
View Articletitled, Highlights from the European Thermal Project PROFIT
Open the PDF for Highlights from the European Thermal Project PROFIT in another window
Topics: Modeling, Reliability, Safety, Steady state, Temperature, Computer software, Electronic products, Temperature gradient
Journal Articles

Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design

Available to Purchase
Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 344–350.
https://doi.org/10.1115/1.1390342
Published Online: March 21, 2001
View Articletitled, Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design
Open the PDF for Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design in another window
Topics: Design, Fluids, Heat transfer, Microchannels, Temperature, Temperature gradient, Flow (Dynamics), Heat, Cooling
Journal Articles

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Available to Purchase
Y. Polsky, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 263–270.
https://doi.org/10.1115/1.2793850
Published Online: December 1, 1999
View Articletitled, Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation
Open the PDF for Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation in another window
Topics: Circuits, Modeling, Printed circuit boards, Reflow soldering, Thermoelasticity, Warping, Copper, Elasticity, Lamination, Micromechanics (Engineering)
Journal Articles

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

Available to Purchase
W. Jung, J. H. Lau, Y.-H. Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 163–170.
https://doi.org/10.1115/1.2792229
Published Online: September 1, 1997
View Articletitled, Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints
Open the PDF for Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints in another window
Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Deformation, Finite element analysis, Manufacturing, Ball-Grid-Array packages, Ceramics, Computation, Constitutive equations
Journal Articles

Dynamic Aspects of Wetting Balance Tests

Available to Purchase
K. W. Moon, W. J. Boettinger, M. E. Williams, D. Josell, B. T. Murray, W. C. Carter, C. A. Handwerker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 174–183.
https://doi.org/10.1115/1.2792149
Published Online: September 1, 1996
View Articletitled, Dynamic Aspects of Wetting Balance Tests
Open the PDF for Dynamic Aspects of Wetting Balance Tests in another window
Topics: Wetting, Plates (structures), Fluids, Glass, Shapes, Solders, Computer software, Equilibrium (Physics), Flow (Dynamics), Shear stress
Journal Articles

Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging

Available to Purchase
Arvind Krishna, B. D. Harper, J. K. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 192–200.
https://doi.org/10.1115/1.2792091
Published Online: September 1, 1995
View Articletitled, Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging
Open the PDF for Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging in another window
Topics: Electronic packaging, Finite element analysis, Temperature, Stress, Creep, Cycles, Diffusion (Physics), Elastic analysis, Failure mechanisms, Finite element methods
Journal Articles

Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays

Available to Purchase
A. K. Mallik, G. P. Peterson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 75–81.
https://doi.org/10.1115/1.2792070
Published Online: March 1, 1995
View Articletitled, Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays
Open the PDF for Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays in another window
Topics: Heat pipes, Steady state, Vapors, Semiconductor wafers, Temperature, Temperature distribution, Temperature gradient, Thermal conductivity, Computer simulation, Flux (Metallurgy)
Journal Articles

Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays

Available to Purchase
G. P. Peterson, A. K. Mallik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 82–87.
https://doi.org/10.1115/1.2792072
Published Online: March 1, 1995
View Articletitled, Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays
Open the PDF for Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays in another window
Topics: Heat pipes, Transients (Dynamics), Vapors, Semiconductor wafers, Computer simulation, Condensation, Imaging, Semiconductor device reliability, Temperature, Temperature gradient
Journal Articles

Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints

Available to Purchase
Morris B. Bowers, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 290–297.
https://doi.org/10.1115/1.2905700
Published Online: December 1, 1994
View Articletitled, Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints
Open the PDF for Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints in another window
Topics: Computer cooling, Design, Heat sinks, Microchannels, Thermal diffusion, Flow (Dynamics), Heat flux, Boiling, Cooling, Critical heat flux
Journal Articles

Study of an Air Cooling Scheme for 3-D Packaging

Available to Purchase
H. Xie, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 30–36.
https://doi.org/10.1115/1.2905490
Published Online: March 1, 1994
View Articletitled, Study of an Air Cooling Scheme for 3-D Packaging
Open the PDF for Study of an Air Cooling Scheme for 3-D Packaging in another window
Topics: Cooling, Packaging, Energy dissipation, Flow (Dynamics), Temperature, Circuits, Electrical measurement, Computer simulation, Flight, Heat sinks
Journal Articles

Modeling of Heat Transfer in the Surface Mounting of Electronic Components

Available to Purchase
S. K. Rastogi, D. Poulikakos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 373–381.
https://doi.org/10.1115/1.2909346
Published Online: December 1, 1993
View Articletitled, Modeling of Heat Transfer in the Surface Mounting of Electronic Components
Open the PDF for Modeling of Heat Transfer in the Surface Mounting of Electronic Components in another window
Topics: Electronic components, Heat transfer, Modeling, Temperature, Cracking (Materials), Fracture (Process), Printed circuit boards, Temperature gradient, Thermal stresses
Journal Articles

On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices

Available to Purchase
A. K. Mallik, G. P. Peterson, M. H. Weichold
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 436–442.
https://doi.org/10.1115/1.2905477
Published Online: December 1, 1992
View Articletitled, On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices
Open the PDF for On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices in another window
Topics: Heat pipes, Semiconductor devices, Computer simulation, Heat, Temperature, Temperature gradient, Density, Flat heat pipes, Flux (Metallurgy), Heat flux
Journal Articles

Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature

Available to Purchase
E. Suhir, L. T. Manzione
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 329–335.
https://doi.org/10.1115/1.2905459
Published Online: September 1, 1992
View Articletitled, Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature
Open the PDF for Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature in another window
Topics: Temperature, Molding, Warping, Cycles, Design, Geometry, Hardening (Curing), Materials properties, Molded plastics, Optimization