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Journal Articles

Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading

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K. Darbha, S. Ling, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 183–188.
https://doi.org/10.1115/1.2792232
Published Online: September 1, 1997
View Articletitled, Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading
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Topics: Stress analysis (Engineering), Surface mount packaging, Printed circuit boards, Solder joints, Stress, Vibration, Boundary-value problems, Damage, Deformation, Fatigue
Journal Articles

A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints

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Zequn Mei, Helen Holder
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 62–66.
https://doi.org/10.1115/1.2792133
Published Online: June 1, 1996
View Articletitled, A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints
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Topics: Fatigue failure, Solder joints, Tin, Coatings, Failure, Agglomeration (Materials), Atoms, Cycles, Failure analysis, Melting
Journal Articles

Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices

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Pardeep K. Bhatti, Klaus Gschwend, Abel Y. Kwang, Ahmer R. Syed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 20–25.
https://doi.org/10.1115/1.2792063
Published Online: March 1, 1995
View Articletitled, Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices
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Topics: Creep, Solder joints, Surface mount devices, Finite element analysis, Computer software, Degrees of freedom, Materials properties, Surface mount components
Journal Articles

A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

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Yu-Wen Huang, K. Srihari, Jim Adriance, George Westby
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 282–289.
https://doi.org/10.1115/1.2905699
Published Online: December 1, 1994
View Articletitled, A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem
Open the PDF for A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem in another window
Topics: Surface mount packaging, Engineering prototypes, Lumber, Machinery, Manufacturing, Nozzles, Printed circuit boards, Surface mount components, Tooling
Journal Articles

Influence of Surface Mount Lead End Geometry on Fatigue Life

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Vineet K. Gupta, Donald B. Barker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1994, 116(2): 157–160.
https://doi.org/10.1115/1.2905505
Published Online: June 1, 1994
View Articletitled, Influence of Surface Mount Lead End Geometry on Fatigue Life
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Topics: Fatigue life, Geometry, Surface mount packaging, Shapes, Solder joints, Solders, Dimensions, Fatigue, Fatigue damage, Finite element analysis
Journal Articles

Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components

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D. B. Barker, Y. S. Chen, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 195–200.
https://doi.org/10.1115/1.2909317
Published Online: June 1, 1993
View Articletitled, Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components
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Topics: Fatigue life, Surface mount components, Vibration, Finite element analysis, Modeling, Printed circuit boards, Reliability, Solder joints, Stress analysis (Engineering)
Journal Articles

Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life

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D. B. Barker, I. Sharif, A. Dasgupta, M. G. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 177–184.
https://doi.org/10.1115/1.2906415
Published Online: June 1, 1992
View Articletitled, Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life
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Topics: Fatigue life, Solder joints, Surface mount components, Stiffness, Finite element analysis, Surface mount packaging, Computation, Design, Dimensions, Failure
Journal Articles

Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry

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Yifan Guo, Charles G. Woychik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 88–92.
https://doi.org/10.1115/1.2905446
Published Online: March 1, 1992
View Articletitled, Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry
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Topics: Interferometry, Solder joints, Strain measurement, Surface mount components, Reliability, Solders, Thermal expansion, Dimensions, Electronic packages, Failure
Journal Articles

A Bonded Joint Analysis for Surface Mount Components

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S. E. Yamada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 1–7.
https://doi.org/10.1115/1.2905436
Published Online: March 1, 1992
View Articletitled, A Bonded Joint Analysis for Surface Mount Components
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Topics: Design, Shear (Mechanics), Shear stress, Stress, Stress concentration, Surface mount components, Surface mount devices, Surface mount packaging
Journal Articles

Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

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Tin-Lup Wong, Karl K. Stevens, Gang Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 244–249.
https://doi.org/10.1115/1.2905402
Published Online: September 1, 1991
View Articletitled, Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components
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Topics: Dynamic models, Dynamic response, Electronic components, Lumber, Modal analysis, Mode shapes, Structural dynamics, Surface mount components, Surface mount packaging, Testing
Journal Articles

Fatigue Analysis of a Planarpak™ Surface Mount Component

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I. Sharif, D. B. Barker, A. Dasgupta, M. G. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1991, 113(2): 194–199.
https://doi.org/10.1115/1.2905387
Published Online: June 1, 1991
View Articletitled, Fatigue Analysis of a Planarpak™ Surface Mount Component
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Topics: Bonding, Fatigue analysis, Fatigue life, Finite element model, Printed circuit boards, Solders, Stress, Surface mount components, Surface mount devices, Thermal stresses