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Journal Articles

Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

A. D. Laws, R. Borwick, III, P. Stupar, J. DeNatale, Y. C. Lee

Publisher: ASME

J. Electron. Packag. December 2009, 131(4): 041005.

https://doi.org/10.1115/1.4000211

Published Online: October 21, 2009

View Article titled, Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

Topics: Design, Physics, Atomic clocks, Temperature, Thermal resistance, Shock (Mechanics), Finite element analysis, Structural analysis

Journal Articles

Shorter Field Life in Power Cycling for Organic Packages

S. B. Park, Izhar Z. Ahmed

Publisher: ASME

J. Electron. Packag. March 2007, 129(1): 28–34.

https://doi.org/10.1115/1.2429706

Published Online: May 1, 2006

View Article titled, Shorter Field Life in Power Cycling for Organic Packages

Topics: Computational fluid dynamics, Finite element analysis, Flip-chip devices, Manufacturing, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Structural analysis, Cycles

Journal Articles

Three-Dimensional Paddle Shift Modeling for IC Packaging

Chien-Chang Pei, Sheng-Jye Hwang

Publisher: ASME

J. Electron. Packag. September 2005, 127(3): 324–334.

https://doi.org/10.1115/1.1938986

Published Online: December 2, 2004

View Article titled, Three-Dimensional Paddle Shift Modeling for IC Packaging

Topics: Computation, Deflection, Flow (Dynamics), Fluid dynamics, Geometry, Integrated circuit packaging, Integrated circuits, Mesh generation, Modeling, Molding

Journal Articles

Fiber Optics Structural Mechanics: Brief Review

Ephraim Suhir

Publisher: ASME

J. Electron. Packag. September 1998, 120(3): 217–220.

https://doi.org/10.1115/1.2792625

Published Online: September 1, 1998

View Article titled, Fiber Optics Structural Mechanics: Brief Review

Topics: Optical fiber, Structural analysis

Journal Articles

Structural Analysis of Printed Circuit Board Systems

Peter A. Engel, Author, J. H. Lau, Reviewer

Publisher: ASME

J. Electron. Packag. September 1993, 115(3): 343–344.

https://doi.org/10.1115/1.2909340

Published Online: September 1, 1993

View Article titled, Structural Analysis of Printed Circuit Board Systems

Topics: Printed circuit boards, Structural analysis

Journal Articles

Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems

Peter A. Engel, Kee Rong Wu

Publisher: ASME

J. Electron. Packag. September 1992, 114(3): 314–321.

https://doi.org/10.1115/1.2905457

Published Online: September 1, 1992

View Article titled, Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems

Topics: Solder joints, Thermal stresses, Stress, Cross section (Physics), Failure mechanisms, Finite element methods, Iterative methods, Plasticity, Pressure, Solders

Journal Articles

Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion

P. A. Engel, J. T. Vogelmann

Publisher: ASME

J. Electron. Packag. June 1992, 114(2): 203–210.

https://doi.org/10.1115/1.2906419

Published Online: June 1, 1992

View Article titled, Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion

Topics: Circuits, Structural analysis, Torsion, Corners (Structural elements), Deflection, Finite element analysis, Finite element methods, Stiffness

Journal Articles

Structural Analysis in Microelectronics

E. Suhir, Author, Peter A. Engel, Reviewer

Publisher: ASME

J. Electron. Packag. June 1992, 114(2): 256.

https://doi.org/10.1115/1.2906427

Published Online: June 1, 1992

View Article titled, Structural Analysis in Microelectronics

Topics: Microelectronic devices, Structural analysis

Journal Articles

Structural Analyses of Spacecraft Electronic Packages

S. Kannappan, V. Kunukkassril

Publisher: ASME

J. Electron. Packag. March 1992, 114(1): 96–99.

https://doi.org/10.1115/1.2905449

Published Online: March 1, 1992

View Article titled, Structural Analyses of Spacecraft Electronic Packages

Topics: Electronic packages, Space vehicles, Structural analysis, Finite element methods, Stress, Computer software, Design, Electronics, Manufacturing, Modal analysis

Journal Articles

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

D. A. Bittle, J. C. Suhling, R. E. Beaty, R. C. Jaeger, R. W. Johnson

Publisher: ASME

J. Electron. Packag. September 1991, 113(3): 203–215.

https://doi.org/10.1115/1.2905397

Published Online: September 1, 1991

View Article titled, Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

Topics: Electronic packages, Sensors, Stress, Structural analysis, Semiconductor wafers, Crystals, Design, Diamonds, Heat conduction, Integrated circuits

Journal Articles

Structural Analysis For Circuit Card Systems Subjected to Bending

P. A. Engel

Publisher: ASME

J. Electron. Packag. March 1990, 112(1): 2–10.

https://doi.org/10.1115/1.2904336

Published Online: March 1, 1990

View Article titled, Structural Analysis For Circuit Card Systems Subjected to Bending

Topics: Circuits, Finite element methods, Modeling, Shapes, Stress, Strips, Structural analysis

Journal Articles

Thermal and Structural Analysis of a PLCC Device for Surface Mount Processes

J. C. Glaser, M. P. Juaire

Publisher: ASME

J. Electron. Packag. September 1989, 111(3): 172–178.

https://doi.org/10.1115/1.3226530

Published Online: September 1, 1989

View Article titled, Thermal and Structural Analysis of a PLCC Device for Surface Mount Processes

Topics: Structural analysis, Surface mount packaging, Soldering, Finite element analysis, Stress, Temperature gradient, Computer simulation, Reliability, Stress concentration, Temperature

Journal Articles

Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction With Experimental and Numerical Techniques

E. Suhir

Publisher: ASME

J. Electron. Packag. June 1989, 111(2): 157–161.

https://doi.org/10.1115/1.3226522

Published Online: June 1, 1989

View Article titled, Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction With Experimental and Numerical Techniques

Topics: Electronic packaging, Modeling, Computer-aided engineering, Mathematics, Structural analysis

Journal citation

NARROW

Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

Shorter Field Life in Power Cycling for Organic Packages

Three-Dimensional Paddle Shift Modeling for IC Packaging

Fiber Optics Structural Mechanics: Brief Review

Structural Analysis of Printed Circuit Board Systems

Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems

Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion

Structural Analysis in Microelectronics

Structural Analyses of Spacecraft Electronic Packages

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

Structural Analysis For Circuit Card Systems Subjected to Bending

Thermal and Structural Analysis of a PLCC Device for Surface Mount Processes

Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction With Experimental and Numerical Techniques

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