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Journal Articles

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

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Ken-ichi Ohguchi, Katsuhiko Sasaki, Setsuo Aso
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
https://doi.org/10.1115/1.3103951
Published Online: March 27, 2009
View Articletitled, Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
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Topics: Creep, Lead-free solders, Stress, Stress-strain relations, Deformation, Waves, Solders, Simulation, Constitutive equations, Alloys
Journal Articles

The Maximum Stress in Optical Glass Fibers Under Two-Point Bending

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Mikio Muraoka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 70–73.
https://doi.org/10.1115/1.1324674
Published Online: June 28, 2000
View Articletitled, The Maximum Stress in Optical Glass Fibers Under Two-Point Bending
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Topics: Bending (Stress), Fibers, Optical glass, Stress, Stress-strain relations, Optical fiber
Journal Articles

Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185]

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X. Q. Shi,, W. Zhou,, H. L. J. Pang, and, Z. P. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2000, 122(1): 74.
https://doi.org/10.1115/1.483136
Published Online: March 1, 2000
View Articletitled, Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185]
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Topics: Alloys, Electrons, Mechanical properties, Solders, Temperature, Eutectic alloys, Soldering, Stress-strain relations, Thermomechanical treatment
Journal Articles

Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling

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Katsuhiko Sasaki, Associate Professor,, Ken-ichi Ohguchi, Research Associate,, Hiromasa Ishikawa, Mem. ASME, Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 379–387.
https://doi.org/10.1115/1.1371927
Published Online: August 24, 1999
View Articletitled, Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling
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Topics: Alloys, Compression, Constitutive equations, Creep, Deformation, Simulation, Solders, Stress, Temperature, Tension
Journal Articles

The Effects of Adhesive Nonlinearity on Thermal Stress in Layered Components

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Wan-Lee Yin, James L. Dale
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 105–109.
https://doi.org/10.1115/1.2905497
Published Online: June 1, 1994
View Articletitled, The Effects of Adhesive Nonlinearity on Thermal Stress in Layered Components
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Topics: Adhesives, Thermal stresses, Stress, Bonding, Materials properties, Stress-strain relations, Variational techniques
Journal Articles

Effect of the Nonlinear Behavior of the Material on Two-Point Bending of Optical Glass Fibers

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E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 246–250.
https://doi.org/10.1115/1.2906425
Published Online: June 1, 1992
View Articletitled, Effect of the Nonlinear Behavior of the Material on Two-Point Bending of Optical Glass Fibers
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Topics: Fibers, Optical glass, Compression, Stress, Stress-strain relations, Tension, Coatings, Deformation