1-6 of 6
Stress singularity
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure

Available to Purchase
Hideo Koguchi, Kazuhisa Hoshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020902.
https://doi.org/10.1115/1.4006139
Published Online: June 11, 2012
View Articletitled, Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure
Open the PDF for Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure in another window
Topics: Bonding, Boundary element methods, Delamination, Resins, Stress, Stress singularity, Silicon, Joining, Stress concentration
Journal Articles

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

Available to Purchase
A. Q. Xu, H. F. Nied
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 301–305.
https://doi.org/10.1115/1.1289768
Published Online: December 1, 2000
View Articletitled, Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages
Open the PDF for Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages in another window
Topics: Corners (Structural elements), Delamination, Epoxy adhesives, Epoxy resins, Finite element analysis, Fracture (Materials), Silicon, Stress, Stress singularity, Geometry
Journal Articles

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Available to Purchase
Cemal Basaran, Assoc. Prof. and Director,, Ying Zhao, Senior Reliability Engineer,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 218–224.
https://doi.org/10.1115/1.1362674
Published Online: July 6, 1999
View Articletitled, Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging
Open the PDF for Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging in another window
Topics: Adhesives, Damage, Elastic analysis, Finite element analysis, Stress, Stress concentration, Electronic packaging, Shear stress, Stress singularity
Journal Articles

The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam

Available to Purchase
Wan-Lee Yin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 208–213.
https://doi.org/10.1115/1.2909319
Published Online: June 1, 1993
View Articletitled, The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam
Open the PDF for The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam in another window
Topics: Thermal stresses, Stress, Elasticity, Polynomials, Stress singularity, Variational techniques, Wedges
Journal Articles

Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits

Available to Purchase
J. C. W. van Vroonhoven
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 28–33.
https://doi.org/10.1115/1.2909298
Published Online: March 1, 1993
View Articletitled, Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits
Open the PDF for Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits in another window
Topics: Adhesion, Delamination, Integrated circuits, Stress singularity, Fracture (Materials), Failure, Fracture (Process), Silicon chips, Stress, Temperature
Journal Articles

A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices

Available to Purchase
T. Hattori, S. Sakata, G. Murakami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 243–248.
https://doi.org/10.1115/1.3226542
Published Online: December 1, 1989
View Articletitled, A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices
Open the PDF for A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices in another window
Topics: Reliability, Stress singularity, Adhesives, Stress, Acoustics, Alloys, Bonding, Delamination, Displacement, Epoxy adhesives