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Journal Articles

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

T.-C. Huang, K.-C. Liao

J. Electron. Packag. March 2023, 145(1): 011206.

Paper No: EP-22-1010

DOI: https://doi.org/10.1115/1.4054822

Published Online: August 3, 2022

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Topics: Shock (Mechanics), Contact resistance, Displacement

Journal Articles

Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition

Guicui Fu, Maogong Jiang, Bo Wan, Yanruoyue Li, Cheng Ma

J. Electron. Packag. March 2019, 141(1): 011004.

Paper No: EP-18-1055

DOI: https://doi.org/10.1115/1.4041984

Published Online: February 25, 2019

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Topics: Bonding, Shock (Mechanics), Wire, Risk assessment

Journal Articles

Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

Phil Geng

J. Electron. Packag. March 2019, 141(1): 010801.

Paper No: EP-18-1046

DOI: https://doi.org/10.1115/1.4042800

Published Online: February 25, 2019

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Topics: Design, Shock (Mechanics), Solder joints, Stress, Structural design, Vibration, Failure, Creep

Journal Articles

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Sharan Kallolimath, Jiang Jenny Zhou

J. Electron. Packag. December 2016, 138(4): 041001.

Paper No: EP-14-1082

DOI: https://doi.org/10.1115/1.4034187

Published Online: August 10, 2016

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Topics: Electrons, Finite element analysis, Lumber, Shock (Mechanics), Simulation, Stress, Solder joints, Modeling, Symmetry (Physics), Boundary-value problems

Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker

J. Electron. Packag. March 2015, 137(1): 011010.

Paper No: EP-14-1001

DOI: https://doi.org/10.1115/1.4028641

Published Online: March 1, 2015

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Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials

S. A. Meguid, Chen Zhuo, Fan Yang

J. Electron. Packag. December 2014, 136(4): 041010.

Paper No: EP-13-1102

DOI: https://doi.org/10.1115/1.4026542

Published Online: September 19, 2014

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Topics: Design, Shock (Mechanics), Stress

Journal Articles

Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules

Se-Chang Kim, Dae-Geun Cho, Tae-Gyu Kim, Se-Hun Jung, Ja-Choon Koo, Moon-Ki Kim, Jae-Boong Choi

J. Electron. Packag. December 2013, 135(4): 041001.

Paper No: EP-13-1004

DOI: https://doi.org/10.1115/1.4024748

Published Online: August 7, 2013

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Topics: Finite element analysis, Finite element model, Shock (Mechanics), Impact testing, Packaging

Journal Articles

Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact

Pradeep Lall, Ryan Lowe, Kai Goebel

J. Electron. Packag. June 2012, 134(2): 021001.

DOI: https://doi.org/10.1115/1.4006706

Published Online: June 11, 2012

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Topics: Damage, Electronics, Failure, Shock (Mechanics), Solders, Spectroscopy, Vibration, Signals, Phase shift, Stress

Journal Articles

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

P. Tumne, V. Venkatadri, S. Kudtarkar, M. Delaus, D. Santos, R. Havens, K. Srihari

J. Electron. Packag. June 2012, 134(2): 020905.

DOI: https://doi.org/10.1115/1.4005906

Published Online: June 11, 2012

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Topics: Alloys, Design, Failure, Failure mechanisms, Intermetallic compounds, Reliability, Semiconductor wafers, Solders, Separation (Technology), Shock (Mechanics)

Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta

J. Electron. Packag. December 2011, 133(4): 041012.

DOI: https://doi.org/10.1115/1.4005091

Published Online: December 9, 2011

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Topics: Damping, Finite element analysis, Modeling, Printed circuit boards, Shock (Mechanics), Manufacturing, Simulation, Simulation results, Cycles, Materials properties

Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta

J. Electron. Packag. December 2011, 133(4): 041010.

DOI: https://doi.org/10.1115/1.4005090

Published Online: December 9, 2011

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Topics: Printed circuit boards, Shock (Mechanics), Manufacturing

Journal Articles

Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

A. D. Laws, R. Borwick, III, P. Stupar, J. DeNatale, Y. C. Lee

J. Electron. Packag. December 2009, 131(4): 041005.

DOI: https://doi.org/10.1115/1.4000211

Published Online: October 21, 2009

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Topics: Design, Physics, Atomic clocks, Temperature, Thermal resistance, Shock (Mechanics), Finite element analysis, Structural analysis

Journal Articles

An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads

Fadi Alsaleem, Mohammad I. Younis, Ronald Miles

J. Electron. Packag. September 2008, 130(3): 031002.

DOI: https://doi.org/10.1115/1.2957319

Published Online: July 29, 2008

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Topics: Microelectromechanical systems, Shock (Mechanics), Stress, Manufacturing, Diaphragms (Mechanical devices), Diaphragms (Structural)

Journal Articles

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling

J. Electron. Packag. December 2007, 129(4): 373–381.

DOI: https://doi.org/10.1115/1.2804085

Published Online: March 25, 2007

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Topics: Ball-Grid-Array packaging, Displacement, Errors, Finite element model, Reliability, Shells, Shock (Mechanics), Transients (Dynamics), Dynamics (Mechanics), Modeling

Journal Articles

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht, Robin Ferebee

J. Electron. Packag. December 2006, 128(4): 339–345.

DOI: https://doi.org/10.1115/1.2351897

Published Online: January 8, 2006

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Topics: Aluminum, Damage, Life testing, Shock (Mechanics), Stress, Vibration, Testing, Printed circuit boards, Cycles, Failure

Journal Articles

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

Rashed Adnan Islam, Y. C. Chan

J. Electron. Packag. December 2005, 127(4): 375–380.

DOI: https://doi.org/10.1115/1.2056570

Published Online: February 14, 2005

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Topics: Anisotropy, Contact resistance, Shock (Mechanics), Particulate matter, Abrasion

Journal Articles

Finite Element Analysis of Mechanical Shock Responses of RF Connectors

Z. Y. Zhu, H. P. Lee, B. T. Cheok

J. Electron. Packag. March 2003, 125(1): 144–152.

DOI: https://doi.org/10.1115/1.1536950

Published Online: March 14, 2003

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Topics: Finite element analysis, Shock (Mechanics)

Journal Articles

Could Shock Tests Adequately Mimic Drop Test Conditions?

E. Suhir, ASME Fellow

J. Electron. Packag. September 2002, 124(3): 170–177.

DOI: https://doi.org/10.1115/1.1487356

Published Online: July 26, 2002

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Topics: Dynamic response, Impulse (Physics), Shock (Mechanics), Vibration, Stress, Life testing, Deflection

Journal Articles

Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards

John Lau, Eric Schneider, Tom Baker

J. Electron. Packag. June 1996, 118(2): 101–104.

DOI: https://doi.org/10.1115/1.2792127

Published Online: June 1, 1996

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Topics: Copper, Flip-chip, Flip-chip devices, Lumber, Shock (Mechanics), Solders, Vibration, Vibration tests, Epoxy adhesives, Epoxy resins

Journal citation

NARROW

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition

Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Stress–Strain Behavior of SAC305 at High Strain Rates

Special Section on InterPACK 2013

Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials

Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules

Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results

Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

Finite Element Analysis of Mechanical Shock Responses of RF Connectors

Could Shock Tests Adequately Mimic Drop Test Conditions?

Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards

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