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Journal Articles

An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

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S. Shakya, S. M. Heinrich, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 74–81.
https://doi.org/10.1115/1.1648058
Published Online: April 30, 2004
View Articletitled, An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
Open the PDF for An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects in another window
Topics: Die cutting, Displacement, Manufacturing, Shear (Mechanics), Shear deformation, Shearing (Deformation), Solders, Stress, Temperature
Journal Articles

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

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Suk-Jin Ham, Soon-Bok Lee, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 282–288.
https://doi.org/10.1115/1.1571571
Published Online: June 10, 2003
View Articletitled, Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry
Open the PDF for Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry in another window
Topics: Creep, Deformation, Finite element analysis, Interferometry, Manufacturing, Relaxation (Physics), Semiconductor wafers, Shear (Mechanics), Solders, Temperature
Journal Articles

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards

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Yarom Polsky, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 1–5.
https://doi.org/10.1115/1.1343111
Published Online: November 29, 2000
View Articletitled, Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards
Open the PDF for Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards in another window
Topics: Deflection, Lamination, Plane strain, Printed circuit boards, Shear (Mechanics), Shear deformation, Stress, Temperature, Warping, Laminates
Journal Articles

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

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B. Han, Mem. ASME, P. Kunthong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 294–300.
https://doi.org/10.1115/1.1290000
Published Online: May 15, 2000
View Articletitled, Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study
Open the PDF for Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study in another window
Topics: Circuits, Deformation, Displacement, Flip-chip devices, Flip-chip packages, Interferometry, Flip-chip assemblies, Metals, Shear deformation, Reliability
Journal Articles

An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

Available to Purchase
S. M. Heinrich, S. Shakya, J. Liang, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 328–334.
https://doi.org/10.1115/1.1289631
Published Online: January 28, 2000
View Articletitled, An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
Open the PDF for An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects in another window
Topics: Creep, Displacement, Shear (Mechanics), Stiffness, Shear deformation, Shapes, Stress, Viscoelastic materials, Viscoelasticity, Solders
Journal Articles

An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

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J. A. Swanson, S. M. Heinrich, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 303–311.
https://doi.org/10.1115/1.2793857
Published Online: December 1, 1999
View Articletitled, An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects
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Topics: Solders, Shear (Mechanics), Deflection, Stiffness, Stress, Deformation, Die cutting, Displacement, Fatigue life, Finite element model
Journal Articles

Shearing Deformation in Partial Areal Arrays: Analytical Results

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S. M. Heinrich, S. Shakya, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 18–23.
https://doi.org/10.1115/1.2792279
Published Online: March 1, 1998
View Articletitled, Shearing Deformation in Partial Areal Arrays: Analytical Results
Open the PDF for Shearing Deformation in Partial Areal Arrays: Analytical Results in another window
Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry
Journal Articles

Thermoplastic Problem of a Thick Orthotropic Beam on Two-Directional Elastic Foundation

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V. Birman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 47–51.
https://doi.org/10.1115/1.2904340
Published Online: March 1, 1990
View Articletitled, Thermoplastic Problem of a Thick Orthotropic Beam on Two-Directional Elastic Foundation
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Topics: Deformation, Differential equations, Shear (Mechanics), Shear deformation, Thermoelasticity