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Journal Articles

Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life

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Jonghwan Ha, Yangyang Lai, Junbo Yang, Pengcheng Yin, Seungbae Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021002.
Paper No: EP-23-1033
https://doi.org/10.1115/1.4063058
Published Online: August 17, 2023
View Articletitled, Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life
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Topics: Fatigue life, Resistors, Shapes, Solder joints, Solders, Thermal shock, Manufacturing
Journal Articles

Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit

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Ping Sun, Bing-Huan Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011005.
Paper No: EP-22-1080
https://doi.org/10.1115/1.4062531
Published Online: June 6, 2023
View Articletitled, Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit
Open the PDF for Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit in another window
Topics: Flow (Dynamics), Heat transfer, Microchannels, Shapes, Temperature, Fins, Circuits, Cooling, Integrated circuits
Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

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Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
View Articletitled, A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging
Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

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Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
https://doi.org/10.1115/1.4052465
Published Online: October 13, 2021
View Articletitled, Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer
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Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors
Journal Articles

Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties

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Karl F. Schoch, Jr., Philip A. Panackal, M. Garrett Bimstefer, Amanda N. Brocki, Daniel N. Urban
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031008.
Paper No: EP-21-1040
https://doi.org/10.1115/1.4052076
Published Online: September 15, 2021
View Articletitled, Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties
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Topics: Putties, Shapes, Stress, Stiffness, Compression, Pressure
Journal Articles

Numerical Investigation of Shape Effect on Microdroplet Evaporation

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Li Shan, Shuai Shuai, Binjian Ma, Zichen Du, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041008.
Paper No: EP-19-1038
https://doi.org/10.1115/1.4044962
Published Online: October 18, 2019
View Articletitled, Numerical Investigation of Shape Effect on Microdroplet Evaporation
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Topics: Diffusion (Physics), Drops, Evaporation, Vapors, Shapes, Simulation
Journal Articles

Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques

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Aleksander Sesek, Olga Chambers, Janez Trontelj
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021005.
Paper No: EP-18-1040
https://doi.org/10.1115/1.4042804
Published Online: March 4, 2019
View Articletitled, Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques
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Topics: Image processing, Image segmentation, X-rays, Shapes, Soldering, Edge detection
Journal Articles

Flexible RFID Tag Inductor Printed by Liquid Metal Ink Printer and Its Characterization

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Yunxia Gao, Rui Liu, Xianping Wang, Jing Liu, Qianfeng Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031007.
Paper No: EP-14-1120
https://doi.org/10.1115/1.4034062
Published Online: July 21, 2016
View Articletitled, Flexible RFID Tag Inductor Printed by Liquid Metal Ink Printer and Its Characterization
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Topics: Inductors, Inks, Liquid metals, Printing, Shapes
Journal Articles

Special Section on InterPACK 2013

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Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Articletitled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Genetic Algorithm Applied to Geometric Optimization of Isothermal Y-Shaped Cavities

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Giulio Lorenzini, Cesare Biserni, Emanuel da Silva Diaz Estrada, Elizaldo Domingues Dos Santos, Liércio André Isoldi, Luiz Alberto Oliveira Rocha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031011.
Paper No: EP-14-1022
https://doi.org/10.1115/1.4027421
Published Online: May 12, 2014
View Articletitled, Genetic Algorithm Applied to Geometric Optimization of Isothermal Y-Shaped Cavities
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Topics: Cavities, Degrees of freedom, Design, Genetic algorithms, Optimization, Shapes, Temperature, Simulation, Geometry
Journal Articles

Geometric Optimization of C-Shaped Cavities According to Bejan's Theory: General Review and Comparative Study

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G. Lorenzini, C. Biserni, L. A. O. Rocha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031007.
Paper No: EP-13-1014
https://doi.org/10.1115/1.4024113
Published Online: June 4, 2013
View Articletitled, Geometric Optimization of C-Shaped Cavities According to Bejan's Theory: General Review and Comparative Study
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Topics: Cavities, Optimization, Shapes, Thermal resistance
Journal Articles

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

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Da Yu, Jae Kwak, Seungbae Park, Soonwan Chung, Ji-Young Yoon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031010.
https://doi.org/10.1115/1.4007118
Published Online: July 23, 2012
View Articletitled, Effect of Shield-Can on Dynamic Response of Board-Level Assembly
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Topics: Deformation, Dynamic response, Failure, Finite element model, Shapes, Solder joints, Stress, Displacement, Stress analysis (Engineering), Manufacturing
Journal Articles

Array of Thermoelectric Coolers for On-Chip Thermal Management

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Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021005.
https://doi.org/10.1115/1.4006141
Published Online: June 11, 2012
View Articletitled, Array of Thermoelectric Coolers for On-Chip Thermal Management
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Topics: Temperature, Thermoelectric coolers, Steady state, Cooling, Transients (Dynamics), Shapes, Temperature control
Journal Articles

Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium

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G. Lorenzini, C. Biserni, L. A. Isoldi, E. D. dos Santos, L. A. O. Rocha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041008.
https://doi.org/10.1115/1.4005296
Published Online: December 9, 2011
View Articletitled, Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium
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Topics: Cavities, Design, Geometry, Optimization, Shapes, Thermal resistance, Degrees of freedom
Journal Articles

Thermal Investigation and Placement Design of High-Brightness LED Array Package on PCB for Uniform Illuminance

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K. C. Yung, H. Liem, H. S. Choy, W. K. Lun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011006.
https://doi.org/10.1115/1.4003514
Published Online: March 9, 2011
View Articletitled, Thermal Investigation and Placement Design of High-Brightness LED Array Package on PCB for Uniform Illuminance
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Topics: Brightness (Photometry), Heat, Light-emitting diodes, Temperature, Design, Modeling, Shapes
Journal Articles

Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

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Giulio Lorenzini, Simone Moretti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
https://doi.org/10.1115/1.3144152
Published Online: July 31, 2009
View Articletitled, Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules
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Topics: Fins, Heat, Heat exchangers, Pressure, Shapes, Temperature, Thermal conductivity, Ducts, Reynolds number, Optimization
Journal Articles

Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

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Afzal Husain, Kwang-Yong Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
https://doi.org/10.1115/1.3103931
Published Online: April 1, 2009
View Articletitled, Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section
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Topics: Design, Heat sinks, Microchannels, Optimization, Thermal resistance, Heat transfer, Response surface methodology, Shapes, Flow (Dynamics), Computer simulation
Journal Articles

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

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K. Lafdi, O. Mesalhy, A. Elgafy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021004.
https://doi.org/10.1115/1.2912185
Published Online: April 25, 2008
View Articletitled, Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications
Open the PDF for Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications in another window
Topics: Cooling, Design, Fins, Heat, Heat sinks, Phase change materials, Porosity, Shapes, Temperature, Thermal conductivity
Journal Articles

Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

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Wei Zhang, Chunqing Wang, Yanhong Tian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011009.
https://doi.org/10.1115/1.2837518
Published Online: February 12, 2008
View Articletitled, Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering
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Topics: Fibers, Solder joints, Soldering, Solders, Surface tension, Geometry, Shapes, Equilibrium (Physics), Yaw
Journal Articles

Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects

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Russell Whitenack, Chandra Desai, Mostafa Rassaian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 356–365.
https://doi.org/10.1115/1.2753981
Published Online: November 13, 2006
View Articletitled, Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects
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Topics: Cycles, Design, Electronic packaging, Failure, Plasticity, Shapes, Solders