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Journal Articles

Warpage Analysis of Underfilled Wafers

Available to Purchase
Hai Ding, I. Charles Ume, Cheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 265–270.
https://doi.org/10.1115/1.1707036
Published Online: July 8, 2004
View Articletitled, Warpage Analysis of Underfilled Wafers
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Topics: Finite element analysis, Semiconductor wafers, Shades and shadows, Warping, Young's modulus, Design, Regression analysis, Regression models
Journal Articles

A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging

Available to Purchase
Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 86–91.
https://doi.org/10.1115/1.483152
Published Online: December 29, 1999
View Articletitled, A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging
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Topics: Warping, Coating processes, Packaging, Temperature, Shades and shadows, Stainless steel
Journal Articles

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Available to Purchase
Y. Polsky, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 263–270.
https://doi.org/10.1115/1.2793850
Published Online: December 1, 1999
View Articletitled, Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation
Open the PDF for Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation in another window
Topics: Circuits, Modeling, Printed circuit boards, Reflow soldering, Thermoelasticity, Warping, Copper, Elasticity, Lamination, Micromechanics (Engineering)
Journal Articles

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

Available to Purchase
S. Wei, S. Wu, I. Kao, F. P. Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 166–170.
https://doi.org/10.1115/1.2792612
Published Online: June 1, 1998
View Articletitled, Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect
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Topics: Semiconductor wafers, Shades and shadows, Diffraction gratings, Diffraction patterns, Inspection, Resolution (Optics), Warping, Lasers, Light sources, Probes
Journal Articles

Installation Effects on Air Temperatures Within Outdoor Electronic Cabinets

Available to Purchase
E. B. Zimmerman, G. T. Colwell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1998, 120(2): 201–206.
https://doi.org/10.1115/1.2792621
Published Online: June 1, 1998
View Articletitled, Installation Effects on Air Temperatures Within Outdoor Electronic Cabinets
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Topics: Temperature, Computer simulation, Electronics, Failure, Shades and shadows, Structures
Journal Articles

System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage

Available to Purchase
M. R. Stiteler, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 1–7.
https://doi.org/10.1115/1.2792196
Published Online: March 1, 1997
View Articletitled, System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage
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Topics: Printed circuit boards, Warping, Reflow soldering, Measurement systems, Shades and shadows, Soldering, Vehicles
Journal Articles

Thermomechanical Behavior of Multilayer Structures in Microelectronics

Available to Purchase
I. M. Daniel, T.-M. Wang, J. T. Gotro
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 11–15.
https://doi.org/10.1115/1.2904332
Published Online: March 1, 1990
View Articletitled, Thermomechanical Behavior of Multilayer Structures in Microelectronics
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Topics: Deformation, Epoxy adhesives, Epoxy resins, Glass, Hardening (Curing), Laminates, Lamination, Microelectronic devices, Polymerization, Residual stresses