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Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

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Paul Paret, Donal Finegan, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
https://doi.org/10.1115/1.4056306
Published Online: December 9, 2022
View Articletitled, Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
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Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)
Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

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Swapnil S. Salvi, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020901.
Paper No: EP-20-1058
https://doi.org/10.1115/1.4049291
Published Online: February 22, 2021
View Articletitled, Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits
Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

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Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041107.
Paper No: EP-19-1131
https://doi.org/10.1115/1.4047409
Published Online: June 26, 2020
View Articletitled, Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
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Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)
Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

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Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
https://doi.org/10.1115/1.4041813
Published Online: February 25, 2019
View Articletitled, Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
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Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry
Journal Articles

Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review

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Bongtae Han, Dae-Suk Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010802.
Paper No: EP-16-1107
https://doi.org/10.1115/1.4035598
Published Online: January 16, 2017
View Articletitled, Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review
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Topics: Diffusion (Physics), Polymers, Temperature, Cavities, Semiconductors (Materials), Packaging, Water, Vapor pressure
Journal Articles

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

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K. S. Siow, Y. T. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 020804.
Paper No: EP-16-1006
https://doi.org/10.1115/1.4033069
Published Online: April 21, 2016
View Articletitled, Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study
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Topics: Patents, Pressure, Sintering, Bonding, Semiconductors (Materials)
Journal Articles

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

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C. L. Gan, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021010.
Paper No: EP-12-1099
https://doi.org/10.1115/1.4024013
Published Online: April 12, 2013
View Articletitled, Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
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Topics: High temperature, Packaging, Reliability, Stress, Wire, Failure mechanisms, Temperature, Semiconductors (Materials), Nanoscale phenomena, Nanoelectronics
Journal Articles

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

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Yutaka Kumano, Tetsuyoshi Ogura, Toru Yamada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
https://doi.org/10.1115/1.3103947
Published Online: April 2, 2009
View Articletitled, High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules
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Topics: Computational fluid dynamics, Junctions, Semiconductors (Materials), Temperature, Thermal conductivity, Modeling, Thermal analysis, Anisotropy
Journal Articles

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

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Samson Yoon, Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024502.
https://doi.org/10.1115/1.2912181
Published Online: May 14, 2008
View Articletitled, Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading
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Topics: Diffusion (Physics), Finite element analysis, Heat transfer, Modeling, Semiconductors (Materials), Stress, Stress analysis (Engineering), Temperature, Deformation, Thermal expansion
Journal Articles

Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

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Brian Smith, Cristina Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 504–511.
https://doi.org/10.1115/1.2804101
Published Online: August 19, 2007
View Articletitled, Simultaneous Electrothermal Test Method for Pyroelectric Microsensors
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Topics: Heat, Manufacturing, Sensors, Temperature, Thermal conductivity, Thermal diffusion, Thermal properties, Boundary-value problems, Microsensors, Strips
Journal Articles

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

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Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
https://doi.org/10.1115/1.1501304
Published Online: December 12, 2002
View Articletitled, Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin
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Topics: Fracture (Materials), Fracture (Process), Fracture toughness, Resins, Semiconductors (Materials), Stress, Temperature, Stress concentration, Finite element analysis, Delamination
Journal Articles

IGBT Package Design for High Power Aircraft Electronic Systems

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Farhad Sarvar, David C. Whalley, Ming K. Low
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 338–343.
https://doi.org/10.1115/1.1390341
Published Online: September 3, 2001
View Articletitled, IGBT Package Design for High Power Aircraft Electronic Systems
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Topics: Design, Electronic systems, Fins, Heat conduction, Heat transfer, Modeling, Steady state, Temperature, Transients (Dynamics), Aircraft
Journal Articles

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

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Sejin Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 20–27.
https://doi.org/10.1115/1.483127
Published Online: August 17, 1999
View Articletitled, Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation
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Topics: Cavities, Flow (Dynamics), Hardening (Curing), Molding, Packing (Shipments), Packings (Cushioning), Pressure, Semiconductors (Materials), Temperature, Viscosity
Journal Articles

Failure Estimation of Semiconductor Chip During Wire Bonding Process

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T. Ikeda, N. Miyazaki, K. Kudo, K. Arita, H. Yakiyama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 85–91.
https://doi.org/10.1115/1.2792672
Published Online: June 1, 1999
View Articletitled, Failure Estimation of Semiconductor Chip During Wire Bonding Process
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Topics: Failure, Semiconductors (Materials), Wire bonding, Gallium arsenide, Pressure, Wire, Cycles, Deformation, Electronic packaging, Metals
Journal Articles

Flow Analysis in a Chip Cavity During Semiconductor Encapsulation

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S. Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 160–167.
https://doi.org/10.1115/1.483149
Published Online: January 11, 1999
View Articletitled, Flow Analysis in a Chip Cavity During Semiconductor Encapsulation
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Topics: Cavities, Cross-flow, Flow (Dynamics), Molding, Epoxy adhesives, Epoxy resins, Semiconductors (Materials)
Journal Articles

Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

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S. Han, K. K. Wang, D. L. Crouthamel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 247–254.
https://doi.org/10.1115/1.2792245
Published Online: December 1, 1997
View Articletitled, Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation
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Topics: Semiconductors (Materials), Wire, Cavities, Epoxy adhesives, Epoxy resins, Manufacturing, Materials properties, Molding, Shapes, Temperature
Journal Articles

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

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S. M. You, T. W. Simon, A. Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 17–25.
https://doi.org/10.1115/1.2792195
Published Online: March 1, 1997
View Articletitled, Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface
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Topics: Heat transfer, Pool boiling, Boiling, Bubbles, Fluids, Heat, Heating, Aluminum, Computer cooling, Platinum
Journal Articles

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

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Sejin Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 178–184.
https://doi.org/10.1115/1.2792089
Published Online: September 1, 1995
View Articletitled, A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments
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Topics: Semiconductors (Materials), Wire, Deformation, Flow (Dynamics), Bubbles, Cavities, Fluids, Model development, Shapes, Transfer molding
Journal Articles

Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection

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S. V. Garimella, D. J. Schlitz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 410–415.
https://doi.org/10.1115/1.2909350
Published Online: December 1, 1993
View Articletitled, Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection
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Topics: Computers, Forced convection, Generators, Temperature, Vortices, Flow (Dynamics), Pressure drop, Reynolds number, Coolants, Cooling
Journal Articles

Heat Pipes for Cooling High Flux/High Power Semiconductor Chips

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M. T. North, C. T. Avedisian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 112–117.
https://doi.org/10.1115/1.2909290
Published Online: March 1, 1993
View Articletitled, Heat Pipes for Cooling High Flux/High Power Semiconductor Chips
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Topics: Cooling, Heat pipes, Power semiconductor devices, Heat, Condensers (steam plant), Flux (Metallurgy), Temperature, Water, Copper powders, Design