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Journal Articles

Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

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Man-Lung Sham, Jang-Kyo Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 47–51.
https://doi.org/10.1115/1.1849232
Published Online: March 21, 2005
View Articletitled, Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications
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Topics: Residual stresses, Resins, Strips, Numerical analysis, Temperature, Finite element analysis, Stress
Journal Articles

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

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Jaap M. J. den Toonder, Mem. ASME, Christian W. Rademaker, Ching-Li Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
https://doi.org/10.1115/1.1604151
Published Online: December 15, 2003
View Articletitled, Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation
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Topics: Capacitors, Ceramics, Computation, Computer simulation, Cooling, Finite element analysis, Residual stresses, Simulation, Sintering, Stress
Journal Articles

Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures

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Mehrdad N. Ghasemi Nejhad, Mem. ASME, Chiling Pan, Hongwei Feng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 4–17.
https://doi.org/10.1115/1.1512295
Published Online: March 14, 2003
View Articletitled, Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures
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Topics: Finite element analysis, Modeling, Residual stresses, Stress, Stress analysis (Engineering), Temperature, Thin films, Microelectromechanical systems
Journal Articles

Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry

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Keith B. Bowman, David H. Mollenhauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 340–344.
https://doi.org/10.1115/1.1497627
Published Online: December 12, 2002
View Articletitled, Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry
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Topics: Interferometry, Polymers, Residual stresses, Stress, Laminates, Temperature, Displacement, Stress concentration
Journal Articles

A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate

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C. Y. Hui, H. D. Conway, Y. Y. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 267–273.
https://doi.org/10.1115/1.1287930
Published Online: September 1, 2000
View Articletitled, A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate
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Topics: Stress, Thin films, Fracture (Materials), Composite materials, Residual stresses, Deformation
Journal Articles

A Study of Process-Induced Residual Stress in PBGA Packages

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Zhu Wu, Jian Lu, Mem. ASME, Yifan Guo, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 262–266.
https://doi.org/10.1115/1.1285983
Published Online: December 8, 1999
View Articletitled, A Study of Process-Induced Residual Stress in PBGA Packages
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Topics: Calibration, Displacement, Stress, Residual stresses, Interferometry
Journal Articles

Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages

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S. Yi, K. Y. Sze
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1998, 120(4): 385–390.
https://doi.org/10.1115/1.2792651
Published Online: December 1, 1998
View Articletitled, Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages
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Topics: Cooling, Finite element analysis, Hardening (Curing), Heat conduction, Manufacturing, Materials properties, Molded plastics, Molding, Residual stresses, Stress
Journal Articles

Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique

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J. Wang, Z. Qian, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 309–313.
https://doi.org/10.1115/1.2792638
Published Online: September 1, 1998
View Articletitled, Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique
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Topics: Flip-chip, Modeling, Packaging, Stress, Manufacturing, Deflection, Finite element analysis, Warping, Alloys, Bonding
Journal Articles

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

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A. S. Voloshin, P.-H. Tsao, R. A. Pearson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1998, 120(3): 314–318.
https://doi.org/10.1115/1.2792639
Published Online: September 1, 1998
View Articletitled, In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive
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Topics: Adhesives, Residual stresses, Epoxy adhesives, Epoxy resins, Stress, Hardening (Curing), Absorption, Cooling, Interferometry, Relaxation (Physics)
Journal Articles

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

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S. Wei, S. Wu, I. Kao, F. P. Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 166–170.
https://doi.org/10.1115/1.2792612
Published Online: June 1, 1998
View Articletitled, Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect
Open the PDF for Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect in another window
Topics: Semiconductor wafers, Shades and shadows, Diffraction gratings, Diffraction patterns, Inspection, Resolution (Optics), Warping, Lasers, Light sources, Probes
Journal Articles

A Rubbery Cure Shrinkage Model for Analyzing Encapsulated Assemblies

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R. S. Chambers, R. R. Lagasse, T. R. Guess, D. J. Plazek, C. Bero
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1995, 117(3): 249–254.
https://doi.org/10.1115/1.2792101
Published Online: September 1, 1995
View Articletitled, A Rubbery Cure Shrinkage Model for Analyzing Encapsulated Assemblies
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Topics: Shrinkage (Materials), Hardening (Curing), Epoxy resins, Finite element analysis, Stress, Temperature, Constitutive equations, Cooling, Damage, Delamination
Journal Articles

Residual Stresses for In-Situ Deposition of Thin-Film High-Temperature Superconductors

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P. E. Phelan, M. N. Ghasemi Nejhad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 249–257.
https://doi.org/10.1115/1.2905695
Published Online: December 1, 1994
View Articletitled, Residual Stresses for In-Situ Deposition of Thin-Film High-Temperature Superconductors
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Topics: High temperature superconductors, Residual stresses, Thin films, Oxygen, Stress, Dimensions, Shrinkage (Materials), Stoichiometry, Temperature, Thermal expansion
Journal Articles

Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections

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M. M. Hou, Thomas W. Eagar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 443–447.
https://doi.org/10.1115/1.2905478
Published Online: December 1, 1992
View Articletitled, Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections
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Topics: Bonding, Low temperature, Transients (Dynamics), Temperature, Tin, Copper, Fatigue, Solders, Aluminum, Diffusion bonding (Metals)
Journal Articles

Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

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A. Dasgupta, C. Oyan, D. Barker, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 152–160.
https://doi.org/10.1115/1.2906412
Published Online: June 1, 1992
View Articletitled, Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach
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Topics: Creep, Fatigue, Solders, Temperature, Cycles, Damage, Finite element methods, Solder joints, Stress, Constitutive equations
Journal Articles

Thermal Stresses in Layered Electrical Assemblies Bonded With Solder

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H. S. Morgan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 350–354.
https://doi.org/10.1115/1.2905419
Published Online: December 1, 1991
View Articletitled, Thermal Stresses in Layered Electrical Assemblies Bonded With Solder
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Topics: Solders, Thermal stresses, Plane strain, Corners (Structural elements), Stress, Creep, Residual stresses, Three-dimensional models, Cooling, Finite element model
Journal Articles

Thermomechanical Behavior of Multilayer Structures in Microelectronics

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I. M. Daniel, T.-M. Wang, J. T. Gotro
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 11–15.
https://doi.org/10.1115/1.2904332
Published Online: March 1, 1990
View Articletitled, Thermomechanical Behavior of Multilayer Structures in Microelectronics
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Topics: Deformation, Epoxy adhesives, Epoxy resins, Glass, Hardening (Curing), Laminates, Lamination, Microelectronic devices, Polymerization, Residual stresses
Journal Articles

Slow Crack Growth in Glasses and Ceramics Under Residual and Applied Stresses

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F. Erdogan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 61–67.
https://doi.org/10.1115/1.3226510
Published Online: March 1, 1989
View Articletitled, Slow Crack Growth in Glasses and Ceramics Under Residual and Applied Stresses
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Topics: Ceramics, Fracture (Materials), Glass, Stress, Residual stresses, Failure, Plates (structures), Surface cracks