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Journal Articles

Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model

Wing K. Yeung, Tung T. Lam

J. Electron. Packag. September 2022, 144(3): 031011.

Paper No: EP-21-1028

DOI: https://doi.org/10.1115/1.4052948

Published Online: December 27, 2021

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Topics: Heat flux, Relaxation (Physics), Temperature, Elemental semiconductors, Temperature gradient, Heat

Journal Articles

Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates

K. N. Prabhu, G. Kumar

J. Electron. Packag. December 2010, 132(4): 041001.

DOI: https://doi.org/10.1115/1.4002899

Published Online: November 19, 2010

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Topics: Solders, Surface roughness, Tin, Wetting, Relaxation (Physics)

Journal Articles

Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C

Ahmad Abu Obaid, Jay G. Sloan, Mark A. Lamontia, Antonio Paesano, Subhotosh Khan, John J. Gillespie, Jr.

J. Electron. Packag. December 2005, 127(4): 430–439.

DOI: https://doi.org/10.1115/1.2070049

Published Online: December 21, 2004

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Topics: Creep, Relaxation (Physics), Solders, Stress, Temperature, Shear (Mechanics), Modeling, Solder joints

Journal Articles

Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling

J. M. J. den Toonder, Y. Ramone, A. R. van Dijken, J. G. J. Beijer, G. Q. Zhang

J. Electron. Packag. September 2005, 127(3): 276–285.

DOI: https://doi.org/10.1115/1.1938990

Published Online: August 12, 2004

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Topics: Creep, Finite element analysis, Modeling, Nanoindentation, Stress, Viscoelasticity, Manganese (Metal), Silicon, Relaxation (Physics), Displacement

Journal Articles

A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film

Naotaka Tanaka, Senior Researcher, Kenya Kawano, Researcher, Hideo Miura, Chief Researcher, Yoshiyuki Kado, Engineer, Ikuo Yoshida, Senior Engineer

J. Electron. Packag. March 2004, 126(1): 82–86.

DOI: https://doi.org/10.1115/1.1648059

Published Online: April 30, 2004

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Topics: Adhesives, Deformation, Relaxation (Physics), Reliability, Stress, Temperature, Design, Glass transition, Elasticity

Journal Articles

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

L. J. Ernst, G. Q. Zhang, K. M. B. Jansen, H. J. L. Bressers

J. Electron. Packag. December 2003, 125(4): 539–548.

DOI: https://doi.org/10.1115/1.1604156

Published Online: December 15, 2003

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Topics: Creep, Molding, Poisson ratio, Stress, Temperature, Relaxation (Physics), Packaging

Journal Articles

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

Suk-Jin Ham, Soon-Bok Lee, Mem. ASME

J. Electron. Packag. June 2003, 125(2): 282–288.

DOI: https://doi.org/10.1115/1.1571571

Published Online: June 10, 2003

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Topics: Creep, Deformation, Finite element analysis, Interferometry, Manufacturing, Relaxation (Physics), Semiconductor wafers, Shear (Mechanics), Solders, Temperature

Journal Articles

Damage Accumulation During Stress Relaxation of Polymer Films in Bending

D. Ingman, Y. Michlin

J. Electron. Packag. September 2002, 124(3): 260–265.

DOI: https://doi.org/10.1115/1.1463731

Published Online: July 26, 2002

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Topics: Damage, Relaxation (Physics), Stress, Strips, Deformation, Polymer films

Journal Articles

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

L. J. Ernst, C. van ’t Hof, D. G. Yang, M. S. Kiasat, G. Q. Zhang, H. J. L. Bressers, J. F. J. Caers, A. W. J. den Boer, J. Janssen

J. Electron. Packag. June 2002, 124(2): 97–105.

DOI: https://doi.org/10.1115/1.1459471

Published Online: May 2, 2002

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Topics: Hardening (Curing), Relaxation (Physics), Shrinkage (Materials), Stress, Modeling, Flip-chip devices, Polymers, Storage, Deformation

Journal Articles

Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

T. Elperin, A. Kornilov, G. Rudin

J. Electron. Packag. December 2000, 122(4): 317–322.

DOI: https://doi.org/10.1115/1.1289635

Published Online: August 9, 1999

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Topics: Microcracks, Semiconductor wafers, Separation (Technology), Temperature, Laser beams, Sprays, Elasticity, Stress, Temperature distribution, Relaxation (Physics)

Journal Articles

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

A. S. Voloshin, P.-H. Tsao, R. A. Pearson

J. Electron. Packag. September 1998, 120(3): 314–318.

DOI: https://doi.org/10.1115/1.2792639

Published Online: September 1, 1998

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Topics: Adhesives, Residual stresses, Epoxy adhesives, Epoxy resins, Stress, Hardening (Curing), Absorption, Cooling, Interferometry, Relaxation (Physics)

Journal Articles

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee

J. Electron. Packag. March 1998, 120(1): 18–23.

DOI: https://doi.org/10.1115/1.2792279

Published Online: March 1, 1998

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Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry

Journal Articles

Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects

S. M. Heinrich, S. Shakya, P. S. Lee

J. Electron. Packag. March 1998, 120(1): 12–17.

DOI: https://doi.org/10.1115/1.2792278

Published Online: March 1, 1998

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Topics: Displacement, Solders, Die cutting, Dimensions, Shearing (Deformation), Thermal energy, Elastic moduli, High temperature, Manufacturing, Relaxation (Physics)

Journal Articles

Z -Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film

L. Li, D. D. L. Chung

J. Electron. Packag. December 1997, 119(4): 255–259.

DOI: https://doi.org/10.1115/1.2792246

Published Online: December 1, 1997

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Topics: Anisotropy, Composite materials, Polymers, Electrical resistivity, Particulate matter, Pressure, Copper, Relaxation (Physics), Stress

Journal Articles

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

W. Jung, J. H. Lau, Y.-H. Pao

J. Electron. Packag. September 1997, 119(3): 163–170.

DOI: https://doi.org/10.1115/1.2792229

Published Online: September 1, 1997

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Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Deformation, Finite element analysis, Manufacturing, Ball-Grid-Array packages, Ceramics, Computation, Constitutive equations

Journal Articles

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

K. X. Hu, C. P. Yeh, X. S. Wu, K. Wyatt

J. Electron. Packag. December 1996, 118(4): 206–213.

DOI: https://doi.org/10.1115/1.2792154

Published Online: December 1, 1996

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Topics: Delamination, Multi-chip modules, Thin films, Stress, Finite element analysis, Fracture (Materials), Polymers, Relaxation (Physics), Reliability

Journal Articles

Modeling the Effects of Mixed Flowing Gas (MFG) Corrosion and Stress Relaxation on Contact Interface Resistance

Shrikar Bhagath, Michael G. Pecht

J. Electron. Packag. December 1993, 115(4): 404–409.

DOI: https://doi.org/10.1115/1.2909349

Published Online: December 1, 1993

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Topics: Corrosion, Modeling, Relaxation (Physics), Stress, Base metals, Contact resistance, Gold plating, Operating temperature, Reliability, Temperature

Journal Articles

Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters

R. G. Ross, Jr., L. C. Wen, G. R. Mon

J. Electron. Packag. June 1993, 115(2): 165–172.

DOI: https://doi.org/10.1115/1.2909313

Published Online: June 1, 1993

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Topics: Construction, Creep, Relaxation (Physics), Solder joints, Stress, Solders, Stiffness, Complex systems, Cycles, Damage

Journal Articles

An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints

Yi-Hsin Pao, Ratan Govila, Scott Badgley, Edward Jih

J. Electron. Packag. March 1993, 115(1): 1–8.

DOI: https://doi.org/10.1115/1.2909296

Published Online: March 1, 1993

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Topics: Fatigue, Finite element analysis, Fracture (Materials), Solder joints, Solders, Stress, Creep, Alloys, Cycles, Failure

Journal Articles

Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling

V. Sarihan

J. Electron. Packag. March 1993, 115(1): 16–21.

DOI: https://doi.org/10.1115/1.2909295

Published Online: March 1, 1993

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Topics: Collapse, Simulation, Solder joints, Temperature, Solders, Alloys, Creep, Design, Electronic packages, Flip-chip

Journal citation

NARROW

Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model

Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates

Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C

Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling

A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry

Damage Accumulation During Stress Relaxation of Polymer Films in Bending

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

Shearing Deformation in Partial Areal Arrays: Analytical Results

Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects

Z -Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

Modeling the Effects of Mixed Flowing Gas (MFG) Corrosion and Stress Relaxation on Contact Interface Resistance

Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters

An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints

Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling

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