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1-20 of 28
Relaxation (Physics)
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Journal Articles
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031003.
Paper No: EP-24-1110
Published Online: April 7, 2025
Topics:
Flow (Dynamics),
Fluids,
Relaxation (Physics),
Simulation,
Temperature,
Vapors,
Heat,
Pressure,
Computational fluid dynamics,
Turbulence
Includes: Supplementary data
Journal Articles
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031011.
Paper No: EP-21-1028
Published Online: December 27, 2021
Journal Articles
Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041001.
Published Online: November 19, 2010
Journal Articles
Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C
Available to PurchaseAhmad Abu Obaid, Jay G. Sloan, Mark A. Lamontia, Antonio Paesano, Subhotosh Khan, John J. Gillespie, Jr.
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 430–439.
Published Online: December 21, 2004
Journal Articles
Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 276–285.
Published Online: August 12, 2004
Journal Articles
A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film
Available to PurchaseNaotaka Tanaka, Senior Researcher, Kenya Kawano, Researcher, Hideo Miura, Chief Researcher, Yoshiyuki Kado, Engineer, Ikuo Yoshida, Senior Engineer
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 82–86.
Published Online: April 30, 2004
Journal Articles
Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 539–548.
Published Online: December 15, 2003
Journal Articles
Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moire´ Interferometry
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 282–288.
Published Online: June 10, 2003
Journal Articles
Damage Accumulation During Stress Relaxation of Polymer Films in Bending
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 260–265.
Published Online: July 26, 2002
Journal Articles
Mechanical Modeling and Characterization of the Curing Process of Underfill Materials
Available to PurchaseL. J. Ernst, C. van ’t Hof, D. G. Yang, M. S. Kiasat, G. Q. Zhang, H. J. L. Bressers, J. F. J. Caers, A. W. J. den Boer, J. Janssen
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 97–105.
Published Online: May 2, 2002
Journal Articles
Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 317–322.
Published Online: August 9, 1999
Journal Articles
In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1998, 120(3): 314–318.
Published Online: September 1, 1998
Journal Articles
Shearing Deformation in Partial Areal Arrays: Analytical Results
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 18–23.
Published Online: March 1, 1998
Journal Articles
Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 12–17.
Published Online: March 1, 1998
Journal Articles
Z -Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 255–259.
Published Online: December 1, 1997
Journal Articles
Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 163–170.
Published Online: September 1, 1997
Journal Articles
An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 206–213.
Published Online: December 1, 1996
Journal Articles
Modeling the Effects of Mixed Flowing Gas (MFG) Corrosion and Stress Relaxation on Contact Interface Resistance
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 404–409.
Published Online: December 1, 1993
Journal Articles
Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 165–172.
Published Online: June 1, 1993
Journal Articles
An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 1–8.
Published Online: March 1, 1993
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